Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins
First Claim
1. A cooling apparatus comprising:
- a thermally conductive base having a main surface; and
a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base, the plurality of thermally conductive pin fins being disposed to facilitate transfer of heat from the thermally conductive base.
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Accused Products
Abstract
A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base and disposed to facilitate the transfer of heat from the thermally conductive base. The thermally conductive base can be a portion of the electronic device to be cooled or a separate structure coupled to the electronic device to be cooled. If a separate structure, the thermally conductive base has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of the electronic device. In one implementation, the wire-bonded pin fins are discrete, looped pin fins separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.
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Citations
20 Claims
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1. A cooling apparatus comprising:
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a thermally conductive base having a main surface; and
a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base, the plurality of thermally conductive pin fins being disposed to facilitate transfer of heat from the thermally conductive base. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A cooled electronic module comprising:
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a substrate and at least one heat generating electronic device attached thereto; and
a cooling apparatus for cooling the at least one heat generating electronic device, the cooling apparatus comprising;
a plurality of thermally conductive pin fins wire-bonded to one of a surface of the at least one heat generating electronic device or a thermally conductive base coupled to a surface of the at least one heat generating electronic device, wherein the plurality of thermally conductive pin fins are disposed to facilitate transfer of heat from the at least one heat generating electronic device. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of fabricating a cooling apparatus comprising:
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providing a thermally conductive base having a main surface; and
wire-bonding a plurality of thermally conductive pin fins to the main surface of the thermally conductive base, wherein the plurality of thermally conductive pin fins are disposed across the main surface to facilitate transfer of heat from the thermally conductive base. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification