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Ruthenium as an underlayer for tungsten film deposition

  • US 20060128150A1
  • Filed: 12/10/2004
  • Published: 06/15/2006
  • Est. Priority Date: 12/10/2004
  • Status: Active Grant
First Claim
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1. A method for depositing a tungsten-containing layer on a substrate, comprising:

  • depositing a metal-containing barrier layer on the substrate;

    depositing a ruthenium layer on the metal-containing layer;

    depositing a tungsten nucleation layer on the ruthenium layer; and

    depositing a tungsten bulk layer on the tungsten nucleation layer.

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