Environmental compliance certification
First Claim
1. A method for certifying that a first manufacturing facility is capable of producing quality printed circuit boards or printed circuit board assemblies of a first particular type, said method comprising the steps of:
- performing an inspection of at least one second manufacturing facility, wherein said at least one second manufacturing facility is known to produce quality printed circuit boards or printed circuit board assemblies of said first particular type;
preparing a first manufacturing process setup standard based on said inspection, said manufacturing process standard comprising at least one environmental compliance standard;
performing an audit of said first manufacturing facility against said first manufacturing process setup standard; and
issuing a process certification to said first manufacturing facility if said first manufacturing facility passes said audit;
wherein said printed circuits or printed circuit assemblies are also of a second particular type and wherein said method further comprises the additional steps of;
performing a second inspection of at least one third manufacturing facility known to produce good printed circuits or printed circuit assemblies of said second particular type;
preparing a second manufacturing process setup standard based on said second inspection of said at least one third manufacturing facility;
performing a second audit on said first manufacturing facility against said second manufacturing process setup standard; and
issuing a second certification to said first manufacturing facility if said first manufacturing facility passes said second audit; and
wherein;
said first particular type is through-hole printed circuit boards;
said second particular type is surface mount printed circuit boards; and
at least one of said inspections or audits is carried out at least in part using a temperature measuring device.
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Accused Products
Abstract
An improved method for certifying that a manufacturing facility is capable of producing quality products of a particular type is disclosed. The improved method may comprise auditing the manufacturing facility against a process standard and issuing a certification to the process standard if the manufacturing facility passes the audit. This improved method is particularly suited to manufacturing facilities producing printed circuit assemblies and/or printed circuit boards. The method may further comprise auditing the manufacturing facility against an environmental compliance standard.
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Citations
7 Claims
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1. A method for certifying that a first manufacturing facility is capable of producing quality printed circuit boards or printed circuit board assemblies of a first particular type, said method comprising the steps of:
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performing an inspection of at least one second manufacturing facility, wherein said at least one second manufacturing facility is known to produce quality printed circuit boards or printed circuit board assemblies of said first particular type;
preparing a first manufacturing process setup standard based on said inspection, said manufacturing process standard comprising at least one environmental compliance standard;
performing an audit of said first manufacturing facility against said first manufacturing process setup standard; and
issuing a process certification to said first manufacturing facility if said first manufacturing facility passes said audit;
wherein said printed circuits or printed circuit assemblies are also of a second particular type and wherein said method further comprises the additional steps of;
performing a second inspection of at least one third manufacturing facility known to produce good printed circuits or printed circuit assemblies of said second particular type;
preparing a second manufacturing process setup standard based on said second inspection of said at least one third manufacturing facility;
performing a second audit on said first manufacturing facility against said second manufacturing process setup standard; and
issuing a second certification to said first manufacturing facility if said first manufacturing facility passes said second audit; and
wherein;
said first particular type is through-hole printed circuit boards;
said second particular type is surface mount printed circuit boards; and
at least one of said inspections or audits is carried out at least in part using a temperature measuring device. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification