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Printed circuit board development cycle using probe location automation and bead probe technology

  • US 20060129955A1
  • Filed: 12/10/2004
  • Published: 06/15/2006
  • Est. Priority Date: 12/10/2004
  • Status: Abandoned Application
First Claim
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1. A method for improving a printed circuit board (PCB) development cycle, comprising:

  • executing a computerized test pad location algorithm to determine one or more test pad locations along one or more respective nets in a PCB design;

    inserting one or more test pads into said PCB design at said one or more test pad locations to generate a modified PCB design.

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