Surface acoustic wave sensor methods and systems
First Claim
1. A sensor system, comprising:
- a sensor chip;
at least two surface acoustic wave (SAW) sensing elements located centrally on a first side of said sensor chip, wherein said at least two SAW sensing elements occupy a common area on said first side of said sensor chip;
an etched diaphragm located centrally on a second side of said sensor chip opposite said first side in association with said at least two SAW sensing elements in order to concentrate a mechanical strain in said etched diagram, thereby providing a high strength, high sensitivity and ease of manufacturing thereof.
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Abstract
Sensor systems and methods are disclosed herein, including a sensor chip, upon which at least two surface acoustic wave (SAW) sensing elements are centrally located on a first side (e.g., front side) of the sensor chip. The SAW sensing elements occupy a common area on the first side of the sensor chip. An etched diaphragm is located centrally on the second side (i.e., back side) of the sensor chip opposite the first side in association with the two SAW sensing elements in order to concentrate the mechanical strain of the sensor system or sensor device in the etched diagram, thereby providing high strength, high sensitivity and ease of manufacturing thereof.
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Citations
23 Claims
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1. A sensor system, comprising:
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a sensor chip;
at least two surface acoustic wave (SAW) sensing elements located centrally on a first side of said sensor chip, wherein said at least two SAW sensing elements occupy a common area on said first side of said sensor chip;
an etched diaphragm located centrally on a second side of said sensor chip opposite said first side in association with said at least two SAW sensing elements in order to concentrate a mechanical strain in said etched diagram, thereby providing a high strength, high sensitivity and ease of manufacturing thereof. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A sensor system, comprising:
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a sensor chip, wherein said sensor chip comprises swept quartz;
at least two surface acoustic wave (SAW) sensing elements located centrally on a first side of said sensor chip, wherein said at least two SAW sensing elements comprise interdigital transducers thereof and occupy a common area on said first side of said sensor chip;
an etched diaphragm located centrally on a second side of said sensor chip opposite said first side in association with said at least two SAW sensing elements in order to concentrate a mechanical strain in said etched diagram, thereby providing a high strength, high sensitivity and ease of manufacturing thereof. herein said first set of reflectors runs opposite said second set of reflectors. - View Dependent Claims (15, 16)
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17. A sensor method, comprising the steps of:
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providing a sensor chip comprising swept quartz;
locating at least two surface acoustic wave (SAW) sensing elements located centrally on a first side of said sensor chip, wherein said at least two SAW sensing elements occupy a common area on said first side of said sensor chip and wherein said at least two SAW sensing elements comprise interdigital transducers thereof;
etching a diaphragm centrally on a second side of said sensor chip opposite said first side in association with said at least two SAW sensing elements in order to concentrate a mechanical strain in said etched diagram, thereby providing a high strength, high sensitivity and ease of manufacturing thereof. - View Dependent Claims (18, 19, 20, 21, 22, 23)
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Specification