Semiconductor device manufacturing method, semiconductor device, laminated semiconductor device, circuit substrate, and electronic apparatus
First Claim
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1. A semiconductor device manufacturing method comprising:
- affixing a semiconductor wafer, which includes a plurality of semiconductor element sections which a conductive material is buried in, to a supporting body via an adhesive layer;
forming a penetrating electrode which penetrates the plurality of semiconductor element sections and has the conductive material, by thinning the semiconductor wafer;
cutting the semiconductor wafer so that the supporting body remains, and dividing the semiconductor wafer into the plurality of semiconductor element sections;
forming a resin layer which selectively covers side walls and corners of the plurality of semiconductor element sections formed by cutting the semiconductor wafer; and
peeling the semiconductor element sections from the supporting body.
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Abstract
A semiconductor device includes a semiconductor element, a penetrating electrode which penetrates the semiconductor element, and a resin layer which selectively covers side walls and corners of the semiconductor element.
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Citations
13 Claims
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1. A semiconductor device manufacturing method comprising:
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affixing a semiconductor wafer, which includes a plurality of semiconductor element sections which a conductive material is buried in, to a supporting body via an adhesive layer;
forming a penetrating electrode which penetrates the plurality of semiconductor element sections and has the conductive material, by thinning the semiconductor wafer;
cutting the semiconductor wafer so that the supporting body remains, and dividing the semiconductor wafer into the plurality of semiconductor element sections;
forming a resin layer which selectively covers side walls and corners of the plurality of semiconductor element sections formed by cutting the semiconductor wafer; and
peeling the semiconductor element sections from the supporting body. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor device comprising:
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a semiconductor element;
a penetrating electrode which penetrates the semiconductor element; and
a resin layer which selectively covers the semiconductor element. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13)
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Specification