Carrier with metal bumps for semiconductor die packages
First Claim
Patent Images
1. A carrier for a semiconductor die package, the carrier comprising:
- (a) a metal layer; and
(b) a plurality of bumps formed in the metal layer, wherein the carrier is for electrically coupling a semiconductor die to a circuit substrate.
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Abstract
A carrier for a semiconductor die package is disclosed. In one embodiment, the carrier includes a metal layer and a plurality of bumps formed in the metal layer. The bumps can be formed by stamping.
14 Citations
32 Claims
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1. A carrier for a semiconductor die package, the carrier comprising:
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(a) a metal layer; and
(b) a plurality of bumps formed in the metal layer, wherein the carrier is for electrically coupling a semiconductor die to a circuit substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor die package comprising:
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(a) a carrier comprising a metal layer, a die attach region, and a plurality of stamped bumps formed in the metal layer; and
(b) a semiconductor die electrically coupled to the die attach region of the carrier. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19)
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20-28. -28. (canceled)
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29. A semiconductor die package comprising:
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a carrier comprising a metal layer, and a plurality of stamped, conical bumps formed in the metal layer; and
a semiconductor die electrically coupled to the carrier. - View Dependent Claims (30, 31, 32)
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Specification