Mock wafer, system calibrated using mock wafer, and method for calibrating automated test equipment
First Claim
1. A mock wafer for calibrating automated test equipment, the mock wafer comprising:
- a printed circuit board having a number of interconnect areas, with each interconnect area comprising a pair of mock die pads that are coupled via a connecting trace.
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Accused Products
Abstract
In one embodiment, a mock wafer for calibrating automated test equipment includes a printed circuit board having a number of interconnect areas, with each interconnect area having a pair of mock die pads that are coupled via a connecting trace. In another embodiment, a method for calibrating automated test equipment (ATE) may include coupling the mock wafer to the ATE, and then causing the ATE to i) index the mock wafer with respect to a test head connector, ii) couple a number of probes or the test head connector to a number of the mock wafer'"'"'s mock die pads, iii) transmit a test signal between a pair of the probes that are coupled via a pair of mock die pads and connecting trace of the mock wafer, and iv) calibrate a selected signal path or paths of the ATE by recording a characteristic of the transmitted test signal.
23 Citations
19 Claims
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1. A mock wafer for calibrating automated test equipment, the mock wafer comprising:
a printed circuit board having a number of interconnect areas, with each interconnect area comprising a pair of mock die pads that are coupled via a connecting trace. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A system, comprising:
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automated test equipment (ATE) comprising i) a processor, and ii) a test head connector that is coupled to a plurality of signal paths of the ATE;
a mock wafer comprising a printed circuit board (PCB) having a number of interconnect areas, with each interconnect area comprising a pair of mock die pads that are coupled via a connecting trace; and
a calibration program, executed by the processor, that causes the ATE to i) index the mock wafer with respect to the test head connector, ii) couple a number of probes of the test head connector to a number of the mock wafer'"'"'s die pads, iii) transmit a test signal between a pair of the probes that are coupled via a pair of mock die pads and connecting trace of the mock wafer, and iv) calibrate a selected signal path or paths of the ATE by recording a characteristic of the transmitted test signal. - View Dependent Claims (13, 14, 15, 16)
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17. A method for calibrating automated test equipment (ATE), comprising:
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coupling a mock wafer into the ATE, the mock wafer comprising a printed circuit board (PCB) having a number of interconnect areas, with each interconnect area comprising a pair of mock die pads that are coupled via a connecting trace; and
causing the ATE to i) index the mock wafer with respect to a test head connector, ii) couple a number of probes of the test head connector to a number of the mock wafer'"'"'s mock die pads, iii) transmit a test signal between a pair of the probes that are coupled via a pair of mock die pads and connecting trace of the mock wafer, and iv) calibrate a selected signal path or paths of the ATE by recording a characteristic of the transmitted test signal. - View Dependent Claims (18, 19)
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Specification