Contact image-sensing module having fingerprint scanning function

• US 20060133655A1
• Filed: 10/27/2005
• Published: 06/22/2006
• Est. Priority Date: 12/21/2004
• Status: Active Grant

• Current Assignee: Dyna Image Corp. (Diodes Incorporated)
• Original Assignee: Lite-On Semiconductor Corporation (Lite-On Technology Corporation)
• Inventors: Cheng, Chia-Chu, Wang, Ming-Ho, Liu, Tzu-Heng
• Granted Patent: US 7,326,912 B2
• Time in Patent Office: Days
• US Class Current: 382/124
• CPC Class Codes: G06V 40/13 Sensors therefor
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/047 Box-like arrangements of PCBs
• CPC Class Codes: H05K 3/4691 Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Abstract

A contact image-sensing module having fingerprint-scanning function is described. The image-sensing module has a flex/rigid composite substrate having a first rigid circuit substrate, a second rigid circuit substrate, a third rigid circuit substrate, and at least one flex circuit board. The first rigid circuit substrate, the second rigid circuit substrate, and the third rigid circuit substrate respectively and electrically connect to the flex circuit board in order to form a first composite substrate, a second composite substrate, and a third composite substrate. Each of the second composite substrate and the third composite substrate respectively is not located in the same plane and has a predetermined angle with respect to the plane where the first composite plane is located.

Claims

1. A contact image-sensing module having fingerprint scanning function, comprising:

a flex/rigid composite substrate having a first rigid circuit substrate, a second rigid circuit substrate, a third rigid circuit substrate, and at least one flex circuit board, wherein the first rigid circuit substrate, the second rigid circuit substrate, and the third rigid circuit substrate are respectively and electrically connected to the flex circuit board in order to form a first composite substrate, a second composite substrate, and a third composite substrate, each of the second composite substrate and the third composite substrate respectively not being positioned in a same plane and having a predetermined angle with respect to a plane where the first composite plane is located;

a linear sensing element array on the second composite substrate;

a light source on the third composite substrate;

a focusing device axially parallel to the linear sensing element array; and

a light-guiding device axially parallel to the linear sensing element array;

wherein the light source is adjacent to one end of the light-guiding device and the focusing device is located between the light-guiding device and the linear sensing element array.

2. The contact image-sensing module in claim 1, wherein each of the first composite substrate, the second composite substrate, and the third composite substrate has a plurality of through holes and electrically-conductive elements each positioned on an inner surface of a corresponding through hole and electrically connected to the first rigid circuit substrate and at least a corresponding flex circuit board associated therewith, the second rigid circuit substrate and the corresponding flex circuit board associated therewith, and the third rigid circuit substrate and at least a flex circuit board associated therewith.

3. The contact image-sensing module in claim 1, wherein the second composite substrate rises upwardly with about 45 degrees of the predetermined angle with respect to the plane where the first composite substrate is located.

4. The contact image-sensing module in claim 1, wherein the third composite substrate is positioned perpendicularly to the first composite substrate.

5. The contact image-sensing module in claim 1, wherein the linear sensing element array electrically connects to the second rigid circuit substrate in the form of chip-on-board (COB).

6. The contact image-sensing module in claim 1, wherein the linear sensing element array includes a plurality of contact image-sensing elements.

7. The contact image-sensing module in claim 1, wherein the light source electrically connects to the third rigid circuit substrate in the form of chip-on-board (COB).

8. The contact image-sensing module in claim 1, wherein the light source is a light emitting diode.

9. The contact image-sensing module in claim 1, wherein the focusing device is a lens.

10. The contact image-sensing module in claim 1, wherein the light-guiding device axially includes a reflecting surface and a light penetrating surface, wherein the reflecting surface is for having a fingerprint placed thereon and the light penetrating surface corresponds to the focusing device.

11. The contact image-sensing module having fingerprint scanning function, comprising:

a flex/rigid composite substrate having a first rigid circuit substrate, a second rigid circuit substrate, and a flex circuit board, the first rigid circuit substrate and the second rigid circuit substrate electrically connecting to the flex circuit board in order to form a first composite substrate and a second composite substrate, the second composite substrate not being located in a same plane as the first composite substrate and having a predetermined angle with respect to a plane where the first composite substrate is located;

a linear sensing element array on the second composite substrate;

a light source on the first composite substrate;

a focusing device axially parallel to the linear sensing element array; and

a light-guiding device axially parallel to the linear sensing element array;

wherein the light source is adjacent to one end of the light-guiding device and the focusing device is positioned between the light-guiding device and the linear sensing element array.

12. The contact image-sensing module in claim 11, wherein each of the first composite substrate and the second composite substrate includes a plurality of through holes and a plurality of electrically-conductive elements, wherein each of the electrically conductive elements is positioned on an inner surface of a corresponding through hole so as to electrically connect to the first rigid circuit substrate and the flex circuit board associated therewith, and the second composite substrate and the flex circuit board associated therewith.

13. The contact image-sensing module in claim 11, wherein the second composite substrate rises upwardly with about 45 degrees of the predetermined angle with respect to the plane where first composite substrate is located.

14. The contact image-sensing module in claim 11, wherein the linear sensing element array electrically connects to the second rigid circuit substrate in the form of chip-on-board (COB).

15. The contact image-sensing module in claim 11, wherein the linear sensing element array includes a plurality of contact image-sensing elements.

16. The contact image-sensing module in claim 11, wherein the light source electrically connects to the first rigid circuit substrate in a dual-in-line-package (DIP) manner.

17. The contact image-sensing module in claim 11, wherein the light source is a light emitting diode.

18. The contact image-sensing module in claim 11, wherein the focusing device is a lens.

19. The contact image-sensing module in claim 11, wherein the light-guiding device axially includes a reflecting surface and a light penetrating surface, wherein the reflecting surface is for having a fingerprint placed thereon and the light penetrating surface corresponds to the focusing device.