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Method for fabricating micro-mechanical devices

  • US 20060134818A1
  • Filed: 12/16/2004
  • Published: 06/22/2006
  • Est. Priority Date: 12/16/2004
  • Status: Active Grant
First Claim
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1. A method of fabricating micro-mechanical devices, the method comprising:

  • etching a mesa in a homogenous wafer;

    bonding the wafer to a patterned substrate with the mesa defining device elements suspended above the substrate;

    removing a portion of the wafer until a desired device thickness is achieved; and

    forming discrete elements of said device by performing a structural etch on the remaining wafer material.

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