Method for fabricating micro-mechanical devices
First Claim
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1. A method of fabricating micro-mechanical devices, the method comprising:
- etching a mesa in a homogenous wafer;
bonding the wafer to a patterned substrate with the mesa defining device elements suspended above the substrate;
removing a portion of the wafer until a desired device thickness is achieved; and
forming discrete elements of said device by performing a structural etch on the remaining wafer material.
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Abstract
A method of fabricating micro-mechanical devices. A mesa is etched in a homogeneous wafer. The wafer is bonded to a patterned substrate with the mesa defining device elements suspended above the substrate. A portion of the wafer is removed until a desired device thickness is achieved. Discrete elements of the device are then formed by performing a structural etch on the remaining wafer material.
25 Citations
12 Claims
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1. A method of fabricating micro-mechanical devices, the method comprising:
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etching a mesa in a homogenous wafer;
bonding the wafer to a patterned substrate with the mesa defining device elements suspended above the substrate;
removing a portion of the wafer until a desired device thickness is achieved; and
forming discrete elements of said device by performing a structural etch on the remaining wafer material. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of fabricating a micro-mechanical device including elements defined in a wafer suspended above a substrate bonded to the wafer, the method comprising:
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forming a mesa in one of a homogeneous wafer and a substrate;
bonding the wafer to the substrate;
removing a portion of the wafer until a desired device thickness is achieved; and
forming discrete elements of said device by performing a structural etch on the remaining wafer material. - View Dependent Claims (9)
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10. A method of fabricating micro-mechanical devices, the method comprising:
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performing a structural etch in a homogeneous wafer to form discrete elements of said device without using a wet chemical etch and only after at least one of the steps of;
a) bonding the wafer to a substrate, and b) removing a portion of the wafer until a desired device thickness is achieved. - View Dependent Claims (11, 12)
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Specification