Injection-molded package for MEMS inertial sensor
First Claim
1. A method of packaging a MEMS device, comprising the steps of:
- providing a substrate having an inertial sensor provided therein or thereon;
attaching a cap to the substrate and sealing the inertial sensor within an interior cavity at least partially formed by the cap and substrate;
inserting the capped substrate into a vacuum chamber and evacuating gasses and/or contaminants contained within the interior cavity to form a reduced pressure or vacuum-filled reference cavity therein; and
injection molding a package about the capped substrate while under a reduced or vacuum pressure within said vacuum chamber.
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Accused Products
Abstract
Methods of packaging devices such as MEMS devices are disclosed. An illustrative method of packaging a device in accordance with an illustrative embodiment of the present invention can include the steps of providing a substrate having an device provided therein or thereon, attaching a cap to the substrate and sealing the device within an interior cavity of the capped substrate, inserting the capped substrate into a vacuum chamber and evacuating gasses and/or contaminants contained within the interior cavity, and then injection molding a package about the capped substrate in the vacuum chamber. A number of small-sized openings disposed through the cap can be utilized to create a controlled vacuum pressure within the interior cavity of the device when the device is in the vacuum chamber, prior to injection molding the package about the capped substrate. In some embodiments, an inert gas can be injected into the evacuated interior cavity to create a partial pressure for the inertial sensor, prior to injection molding the package about the capped substrate.
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Citations
35 Claims
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1. A method of packaging a MEMS device, comprising the steps of:
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providing a substrate having an inertial sensor provided therein or thereon;
attaching a cap to the substrate and sealing the inertial sensor within an interior cavity at least partially formed by the cap and substrate;
inserting the capped substrate into a vacuum chamber and evacuating gasses and/or contaminants contained within the interior cavity to form a reduced pressure or vacuum-filled reference cavity therein; and
injection molding a package about the capped substrate while under a reduced or vacuum pressure within said vacuum chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of packaging a device, comprising the steps of:
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providing a substrate having an device provided therein or thereon;
providing a cap having a number openings;
attaching the cap to the substrate and sealing the device within an interior cavity at least partially formed by the cap and substrate;
inserting the capped substrate into a vacuum chamber and drawing gasses and/or contaminants contained within the interior cavity out through the openings to form a controlled vacuum pressure within the interior cavity; and
injection molding a package about the capped substrate. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A method of packaging a device, comprising the steps of:
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providing a substrate having an device provided therein or thereon;
attaching a cap to the substrate and sealing the device within an interior cavity at least partially formed by the cap and substrate;
providing a lead frame including one or more conductive leads;
attaching the capped substrate to the lead frame and electrically connecting the device to the one or more conductive leads of the lead frame;
inserting the capped substrate and lead frame into a vacuum chamber and evacuating gasses and/or contaminants contained within the interior cavity to form a reduced pressure or vacuum-filled reference cavity therein; and
injection molding a package about the capped substrate and at least a portion of the lead frame while under a reduced or vacuum pressure within said vacuum chamber.
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32. A method of packaging a device, comprising the steps of:
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providing a substrate having an device provided therein or thereon;
providing a cap having a number openings therethrough;
attaching the cap to the substrate and sealing the inertial sensor within an interior cavity that is at least partially formed by cap and substrate;
inserting the capped substrate into a vacuum chamber and drawing gasses and/or contaminants contained within the interior cavity out through the openings to form a controlled vacuum pressure therein;
injecting an inert gas into the interior cavity through the openings to form a partial pressure therein; and
injection molding a package about the capped substrate.
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33. A method of packaging a device, comprising the steps of:
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providing a substrate having a device provided therein or thereon;
attaching a cap to the substrate and sealing the device within an interior cavity at least partially formed by the capped substrate;
inserting the capped substrate into a vacuum chamber and evacuating gasses and/or contaminants contained within the interior cavity to form a reduced pressure or vacuum-filled reference cavity therein; and
injection molding a metal or ceramic package about the capped substrate while under a reduced or vacuum pressure within said vacuum chamber.
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34. A method of packaging a MEMS device, comprising the steps of:
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providing a substrate having an inertial sensor provided therein or thereon;
attaching a cap to the substrate and sealing the inertial sensor within an interior cavity at least partially formed by the cap and substrate;
inserting the capped substrate into a vacuum chamber and evacuating gasses and/or contaminants contained within the interior cavity to form a reduced pressure or vacuum-filled reference cavity therein; and
injection molding a package about the capped substrate while under a reduced or vacuum pressure within the vacuum chamber.
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35-46. -46. (canceled)
Specification