Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same

• US 20060134827A1
• Filed: 01/20/2006
• Published: 06/22/2006
• Est. Priority Date: 09/02/2004
• Status: Active Grant

• Current Assignee: Alan G. Wood, Charles M. Watkins, Peter A. Benson, Warren M. Farnworth
• Original Assignee: Alan G. Wood, Charles M. Watkins, Peter A. Benson, Warren M. Farnworth
• Inventors: Watkins, Charles M., Farnworth, Warren M., Wood, Alan G., Benson, Peter A.
• Granted Patent: US 7,488,618 B2
• Time in Patent Office: Days
• US Class Current: 438/106
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/12041 LED

Abstract

Microlenses for directing radiation toward a sensor of an imaging device include a plurality of mutually adhered layers of cured optically transmissive material. Systems include at least one microprocessor, a substrate including an array of microlenses formed thereon in electrical communication with the at least one microprocessor. At least one microlens in the array includes a plurality of mutually adhered layers of cured optically transmissive material.

Claims

1. A microlens for directing radiation toward a sensor of an imaging device, comprising:

a plurality of mutually adhered layers of cured optically transmissive material.

2. The microlens of claim 1, wherein an exterior surface thereof exhibits stair-stepping.

3. The microlens of claim 1, wherein the plurality of mutually adhered layers comprises at least one of a photopolymer and a thermoplastic.

4. A system, comprising:

at least one microprocessor;

a substrate including an array of microlenses formed thereon in electrical communication with the at least one microprocessor;

wherein the array of microlenses includes at least one microlens comprising a plurality of mutually adhered layers of cured optically transmissive material.

5. The system of claim 4, wherein an exterior surface thereof exhibits stair-stepping.

6. The system of claim 4, wherein the plurality of mutually adhered layers comprises at least one of a photopolymer and a thermoplastic.