Method for forming hermetic glass bead assembly having high frequency compensation

• US 20060134939A1
• Filed: 01/10/2006
• Published: 06/22/2006
• Est. Priority Date: 03/01/2004
• Status: Abandoned Application

• Current Assignee: Anritsu Corporation
• Original Assignee: Anritsu Corporation
• Inventors: Oldfield, William W., Moberg, Maurice W.
• Application Number:
  US11/328,636
• Publication Number:
  US 20060134939A1
• Time in Patent Office: Days
• US Class Current: 439/63
• CPC Class Codes: H01R 2103/00 Two poles
• CPC Class Codes: H01R 24/44 comprising impedance matching means

Abstract

Methods and devices in accordance with the present invention can comprise forming an electrical feed-through assembly to provide a hermetic seal in a coaxial connector. In one embodiment, the electrical feed-through assembly comprises a conductive insert having a bore, a dielectric insert positioned within the bore having a first diameter sized such that an impedance of the dielectric insert is a target impedance, the dielectric insert having a center conductive pin extending there-through, and an air dielectric positioned within the bore, the air dielectric having a second diameter sized such that an impedance of the air dielectric is the target impedance, a portion of the air dielectric extending into the dielectric insert, wherein the portion of the air dielectric extending into the dielectric insert is a compensation gap.

Claims

1. A method of forming a bead for use in an electrical feed-through assembly to provide a hermetic seal in a coaxial connector, comprising:

positioning a sleeve;

positioning a plug concentrically within a portion of the sleeve, the plug having a diameter smaller than an inner diameter of the sleeve;

positioning a center conductor pin extending from the plug so that the center conductor pin is approximately centered axially within the sleeve;

flowing a liquefied dielectric into the sleeve;

cooling the liquefied dielectric; and

removing the plug from within the portion of the sleeve.

2. A method of forming an electrical feed-through assembly including a conductive insert having a bore having a first portion with a diameter sized such that an impedance of an air dielectric formed in the first portion is a target impedance and a second portion with a diameter sized such that an impedance of a glass dielectric formed in the second portion is the target impedance, the method comprising:

positioning a plug within the first portion of the bore;

positioning a center conductor pin within the plug so that when the plug is positioned within the bore, the center conductor pin is approximately centered axially within the bore;

flowing a liquefied dielectric into the conductive insert such that the liquefied dielectric fills the second portion of the bore not occupied by the plug;

cooling the liquefied dielectric; and

removing the plug from within the bore.

4. The method of claim 2, wherein the bore further has a cavity extending from the first portion such that the cavity surrounds a portion of the second portion, the method further comprising:

flowing a liquefied dielectric into the conductive insert such that the liquefied dielectric fills the cavity.

3. A method of forming an electrical feed-through assembly including a conductive insert having a bore having a first portion with a diameter sized such that an impedance of an air dielectric formed in the first portion is a target impedance and a second portion with a diameter sized such that an impedance of a glass dielectric formed in the second portion is the target impedance, the method comprising:

positioning a plug within the first portion of the bore such that the plug extends partially into the second portion of the bore;

positioning a center conductor pin within the plug so that when the plug is positioned within the bore, the center conductor pin is approximately centered axially within the bore;

flowing a liquefied dielectric into the conductive insert such that the liquefied dielectric fills the second portion of the bore not occupied by the plug;

cooling the liquefied dielectric; and

removing the plug from within the bore.