Component mounting apparatus, service providing device and servicing method

• US 20060136787A1
• Filed: 01/30/2006
• Published: 06/22/2006
• Est. Priority Date: 01/10/2001
• Status: Active Grant

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Yano, Toshio, Takahashi, Ken, Iizuka, Akira, Sarashina, Eigo, Isobata, Yoshinori, Okamura, Hiroshi, Masui, Masuo, Misawa, Yoshihiko
• Granted Patent: US 7,536,236 B2
• Time in Patent Office: Days
• US Class Current: 714/39
• CPC Class Codes: G05B 19/41805 characterised by assembly
• CPC Class Codes: G05B 2219/31457 Factory remote control, monitoring through internet
• CPC Class Codes: G05B 2219/32226 Computer assisted repair, maintenance of system components
• CPC Class Codes: G05B 2219/45026 Circuit board, pcb
• CPC Class Codes: G06Q 10/10 Office automation; Time management
• CPC Class Codes: H05K 13/0465 by soldering H05K13/0469 takes precedence
• CPC Class Codes: H05K 13/0882 Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such H05K13/083 takes precedence
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/5137 including assembling or disassembling station
• CPC Class Codes: Y10T 29/53022 with means to test work or product
• CPC Class Codes: Y10T 29/53161 including deforming means
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 Chip component

Abstract

A service receiving method for receiving a component library including component size necessary for mount production, by inputting, via a service receiver, to a service provider, mounted component data having the results of fabrication of non-defective products, through the communication system that includes the Internet and deriving, by the service receiver, the component library from a mounted component database provided in the service provider, the mounted component database containing the input mounted component data accumulated for each type of component.

Claims

1. A service receiving method for receiving a component library including component size necessary for mount production, by the use of a service receiver provided at a user side, for mount production using a component mounting apparatus or a component mounting line, from a service provider provided at a supplier side or a serviceperson side of the component mounting apparatus, the component mounting device including a component supplier for supplying a component and a component holder for holding the component from the component supplier and mounting the component onto a circuit board, or the component mounting line in which connection is made so as to include the component mounting apparatus, via a communication system including the Internet, the method comprising:

inputting, via the service receiver, to the service provider, mounted component data having the results of fabrication of non-defective products, through the communication system; and

deriving, by the service receiver, the component library from a mounted component database provided in the service provider, the mounted component database containing the input mounted component data accumulated for each type of component.

2. A service receiving method for receiving mounting technique data including cream solder information or adhesive information necessary for mount production, by the use of a service receiver provided by a user side for mount production using a cream solder printer or an adhesive applicator, from a service provider provided at a supplier side or a serviceperson side of the cream solder printer for printing a cream solder on a circuit board for mounting a component thereon, or of the adhesive applicator for applying an adhesive for adhering components onto the board, via a communication system including the Internet, the method comprising:

inputting, by the service receiver, to the service provider, mounting technique data having the results of fabrication of non-defective products, via the communication system; and

deriving, by the service receiver, the mounting technique data from a mounting technique database provided in the service provider, the mounting technique database containing the input mounting technique data accumulated for each type of component, cream solder, adhesive, or circuit board.

3. A service providing method for providing a component library including component size necessary for mount production, from a service provider provided at a supplier side or a serviceperson side of a component mounting apparatus, the component mounting apparatus including a component supplier for supplying a component and component holder for holding the component from the component supplier and mounting the component onto a circuit board, or a component mounting line in which connection is made so as to include the component mounting apparatus, to a service receiver provided at a user side for mount production using the component mounting apparatus or the component mounting line via a communication system including the Internet, the method comprising:

receiving and collecting, by the service provider, mounted component data having the results of fabrication of non-defective products input by the service receiver via the communication system; and

accumulating, by the service provider, the input mounted component data for each type of component in a mounted component database, from which the component library is derived by the service receiver.

4. The service providing method according to claim 3, further comprising, requesting, by the service provider, that the service receiver input the mounted component data.

5. The service providing method according to claim 3, further comprising deriving the component library by retrieving and extracting the contents of the mounted component database by specifying the type or a shape of the component.

6. A service providing device provided at a supplier side or a serviceperson side of a component mounting apparatus, the component mounting apparatus comprising a component supplier for supplying a component and component holder for holding the component from the component supplier and mounting the component onto a circuit board, or a component mounting line in which connection is made so as to include the component mounting apparatus, the service providing device configured for providing a component library, including component size necessary for mount production, to a service receiver provided at a user side for mount production using the component mounting apparatus or the component mounting line via a communication system including the Internet, the service providing device comprising:

a mounted component database including mounted component data having the results of fabrication of non-defective products input by the service receiver via the communication system, the input mounted component data being accumulated for each type of component; and

a controller configured for deriving the component library from the mounted component database in response to a request from the service receiver.

7. A service providing method for providing mounting technique data including cream solder information or adhesive information necessary for mount production, from a service provider provided at a supplier side or a serviceperson side of a cream solder printer for printing a cream solder on a circuit board for mounting a component thereon, or an adhesive applicator for applying an adhesive for adhering components onto the circuit board, to a service receiver provided at a user side for mount production using the cream solder printer or the adhesive applicator, via a communication system including the Internet, the method comprising:

receiving and collecting, by the service provider, mounting technique data having the results of fabrication of non-defective products input by the service receiver via the communication system; and

accumulating, by the service provider, the input mounting technique data for each type of component, cream solder, adhesive, or circuit board in a mounting technique database, from which the mounting technique data is derived by the service receiver.

8. The service providing method according to claim 7, wherein the service providing device includes a printing condition database for storing printing condition of the cream solder within the mounting technique database, and

wherein the service provider derives cream solder characteristic information or printing condition information from the printing condition database in response to a request from the service receiver.

9. The service providing method according to claim 8, further comprising requesting, by the service provider, the service receiving device to input the mounting technique data regarding cream solder printing.

10. The service providing method according to claim 8, wherein the cream solder characteristic information includes a product number, a particle size, and a viscosity, the method further comprising:

retrieving, by the service provider, for the product number, and if the retrieving fails, retrieving for the particle size or the viscosity, so as to obtain cream solder characteristic information close to the desired product number in the retrieved cream solder characteristic information as a result of the retrieving.

11. A service providing device provided at a supplier side or a serviceperson side of a cream solder printer for printing a cream solder on a circuit board for mounting a component thereon, or an adhesive applicator for applying an adhesive for adhering components onto the board, the service providing device configured for providing mounting technique data including cream solder information or adhesive information necessary for mount production to a service receiver provided at a user side for mount production using the cream solder printer or the adhesive applicator via a communication system including the Internet, the device comprising:

a mounting technique database including mounting technique data having the results of fabrication of non-defective products input by the service retriever via the communication system, the input mounting technique data being accumulated for each type of component, cream solder, adhesive, or circuit board; and

a controller configured for deriving the mounting technique data from the mounting technique database in response to a request from the service receiver.