Pressure sensor with integrated structure

• US 20060137461A1
• Filed: 06/09/2004
• Published: 06/29/2006
• Est. Priority Date: 06/13/2003
• Status: Active Grant

• Current Assignee: Sicpa Holding SA
• Original Assignee: Olivetti I-Jet SpA (ION Investment Group Ltd.)
• Inventors: Conta, Renato, Bellini, Paolo
• Granted Patent: US 7,401,521 B2
• Time in Patent Office: Days
• US Class Current: 73/754
• CPC Class Codes: G01L 19/0627 Protection against aggressive medium in general
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10155 being other than a cuboid
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

Pressure sensor with an integrated structure comprising a support (33, 133, 233) and a silicon die (11), which lies substantially on the same plane as the upper surface (37, 137, 237) of the support and is integrated in a seat (34, 134, 234) made in the thickness of the support. On the inside face (23) of the die (11), in contact with the fluid the pressure of which has to be measured, is a protective layer.

Claims

1. Pressure sensor with an integrated structure comprising:

a silicon die, having an upper edged, an inner face, and an outer face on which piezoresistors are mounted,

a support having an upper surface, and a seat suitable for containing the die,

a container suitable for implementation in such a way as to put the die in contact with the fluid the pressure of which has to be measured, wherein said die is integrated in said seat, made in the thickness of the support.

2. Pressure sensor with integrated structure according to claim 1 wherein the seat passes through the support

3. Pressure sensor with integrated structure according to claim 1 wherein a step is made on the inner surface of the container, enabling improved gluing of the support.

4. Pressure sensor with integrated structure according to claim 1:

wherein the upper edge of the die is substantially on the same plane as the upper surface of the support.

5. Pressure sensor with integrated structure according to claim 1:

wherein the inner face of the die in contact with the fluid the pressure of which has to be measured.

6. Pressure sensor with integrated structure according to claim 1:

wherein on the inner face of the die, in contact with the fluid to be measured, is a layer of protection made from chromium, tantalum, silicon carbide alloys.

7. Pressure sensor with integrated structure according to claim 1:

wherein in the vicinity of the upper surface of the support, on the inside of the seat, a step is made that runs along the edge of the seat itself.

8. Pressure sensor with integrated structure according to claim 7 wherein the die is assembled in such a way that the upper edge of the die is in abutment with the step.

9. Pressure sensor with integrated structure according to claim 7:

wherein the surface of the part of the step, that is in contact with the upper edge of the die, is less than the surface of the upper edge itself.

10. Pressure sensor with integrated structure according to claim 1:

wherein in the vicinity of the lower surface of the support, on the inside of the seat, a step is made that runs along the edge of the seat itself.

11. Pressure sensor with integrated structure according to claim 10:

wherein the upper edge of the die is substantially on the same plane as the upper surface of the support.

12. Pressure sensor with integrated structure according to claim 10:

wherein the die is assembled in such a way that its outer face is in abutment with the step.