Workpiece processing using ozone gas and solvents

• US 20060137723A1
• Filed: 02/15/2006
• Published: 06/29/2006
• Est. Priority Date: 05/09/1997
• Status: Abandoned Application

• Current Assignee: Semitool Incorporated (Applied Materials Incorporated)
• Original Assignee: Semitool Incorporated (Applied Materials Incorporated)
• Inventors: Bergman, Eric J.
• Application Number:
  US11/354,642
• Publication Number:
  US 20060137723A1
• Time in Patent Office: Days
• US Class Current: 134/34
• CPC Class Codes: B08B 2203/005 the liquid being ozonated
• CPC Class Codes: B08B 2203/0288 Ultra or megasonic jets
• CPC Class Codes: B08B 2230/01 Cleaning with steam
• CPC Class Codes: B08B 3/02 Cleaning by the force of jets or sprays
• CPC Class Codes: B08B 3/08 the liquid having chemical or dissolving effect substances used, see the relevant classes
• CPC Class Codes: B08B 7/00 Cleaning by methods not provided for in a single other subclass or a single group in this subclass
• CPC Class Codes: H01L 21/02052 Wet cleaning only H01L21/02085 takes precedence
• CPC Class Codes: H01L 21/02054 combining dry and wet cleaning steps H01L21/02085 takes precedence
• CPC Class Codes: H01L 21/6704 for wet cleaning or washing

Abstract

In systems and methods for cleaning a wafer having metal areas, a non-aqueous polar solvent solution is applied onto the wafer, while the wafer is also contacted by ozone gas. The solvent helps to make the chemical bonds of contaminants on the wafer susceptible to oxidation by the ozone. The ozone readily oxidizes the contaminants in the presence of the solvent. The solvent provides a liquid medium for carrying away oxidized contaminants or by products. Corrosion of metal on the wafer is minimized or eliminated as the solvent helps to control the level of ions and galvanic cell effects. Higher process temperatures may be used to accelerate the cleaning process, without causing corrosion.

Claims

1. A method for cleaning one or more workpieces having a metal area, comprising:

placing the workpiece into a processing chamber;

introducing a non-aqueous polar liquid onto the workpiece;

introducing ozone into the processing chamber;

with the ozone oxidizing contaminants on the workpiece, to clean the workpiece.

2. The method of claim 1 wherein the ozone is introduced into the processing chamber as a dry gas.

3. The method of claim 1 wherein the liquid is heated to a temperature of 30-95°

C.

4. The method of claim 1 wherein the liquid comprises an organic acid, and alcohol or an aldehyde.

5. The method of claim 1 wherein the workpiece comprises a silicon wafer, and the contaminant comprises photoresist.

6. The method of claim 1 further comprising the step of rotating the workpiece within the processing chamber.

7. The method of claim 1 wherein the ozone is entrained in the liquid before the liquid is introduced onto the workpiece.

8. The method of claim 1 wherein the liquid and the ozone are introduced separately into the processing chamber.

9. The method of claim 1 wherein the liquid is sprayed onto the workpiece.

10. The method of claim 1 with the liquid further comprising an additive selected from the group consisting of HF, NH3 and carbon dioxide gas.

11. The method of claim 1 further comprising rotating a batch of workpieces in the process chamber.

12. The method of claim 1 where the metal area comprises copper or aluminum.

13. The method of claim 1 further including rinsing and drying the workpiece.

14. A method for processing a workpiece having metal on a surface of the workpiece, comprising:

forming a layer of a polar non-aqueous liquid on a surface of a workpiece;

contacting the surface of the workpiece with ozone gas in the layer of liquid, with the ozone chemically reacting with a contaminant at the surface of the workpiece.

15. The method of claim 14 further including heating the liquid.

16. The method of claim 14 further including spraying the liquid onto the surface of the workpiece and rotating the workpiece.

17. A method for cleaning one or more workpieces having one or more metal areas, comprising:

placing the workpiece into a processing chamber;

introducing a vapor of a non-aqueous polar liquid onto the workpiece, with vapor condensing on the workpiece;

introducing ozone into the processing chamber;

with the ozone oxidizing contaminants on the article, to clean the workpiece.

18. The method of claim 17 where the vapor includes an organic acid, and alcohol or an aldehyde.

19. An apparatus for cleaning a workpiece comprising:

a chamber;

a workpiece holder in the chamber;

liquid outlets in the chamber positioned to apply liquid onto at least one surface of a workpiece supported by the workpiece holder;

a source of non-aqueous polar liquid connecting with the liquid outlets;

a source of ozone gas connecting into the chamber.

20. The apparatus of claim 19 wherein the workpiece holder comprises a rotor for rotating the workpiece.

21. The apparatus of claim 19 further comprising a liquid heater for heating the liquid.

22. The apparatus of claim 19 further comprising a workpiece heater in the chamber for heating the workpiece.

23. Apparatus comprising:

(a) means for forming a layer of a non-aqueous polar liquid on the surface of a workpiece;

(b) means for supplying ozone gas to the surface of the workpiece, where the ozone oxidizes contamination on the surface to clean the workpiece.

24. The apparatus of claim 23 further including means for heating the surface of the workpiece.

25. The apparatus of claim 23 further including means for heating the non-aqueous polar liquid before supplying the liquid onto the workpiece.