Biochip

• US 20060137984A1
• Filed: 12/01/2003
• Published: 06/29/2006
• Est. Priority Date: 12/19/2002
• Status: Active Grant

• Current Assignee: Boehringer Ingelheim Vetmedica GmbH (C.H. Boehringer Sohn AG & Co. KG)
• Original Assignee: Boehringer Ingelheim Vetmedica GmbH (C.H. Boehringer Sohn AG & Co. KG)
• Inventors: Gumbrecht, Walter, Stanzel, Manfred
• Granted Patent: US 8,753,874 B2
• Time in Patent Office: Days
• US Class Current: 204/600
• CPC Class Codes: C12M 1/34 Measuring or testing with condition measuring or sensing means, e.g. colony counters
• CPC Class Codes: G01N 27/026 Dielectric impedance spectroscopy electrochemical impedance spectroscopy for measuring corrosion G01N17/02
• CPC Class Codes: G01N 33/5438 Electrodes

Abstract

A biochip includes a flat carrier and an array of spots containing catcher molecules which are arranged on the carrier. Each spot is associated with a microelectrode arrangement for impedance spectroscopic detection of binding events occurring between the catcher molecules and the target molecules applied via an analyte solution. In order to increase the sensitivity or the binding-specific measuring effects of the bio-chip, the electrode arrangement is at least partially embedded in a hydrophilic reaction layer containing catcher molecules and which is permeable to target molecules.

Claims

1. A DNA chip, comprising:

a flat carrier; and

,

an array of spots containing catcher molecules, each spot being assigned a microelectrode arrangement for detecting binding events between the catcher molecules and target molecules applied via an analyte solution, the electrode arrangement being at least partially embedded in a hydrophilic reaction layer which is permeable to target molecules and in which immobilized catcher molecules are distributed three-dimensionally.

2. The DNA chip as claimed in claim 1, wherein a thickness of the reaction layer is 2 to 100 μ

m.

3. The DNA chip as claimed in claim 2, wherein the reaction layer has a thickness laying approximately in the range of 1 to 5 L, L being the sum of electrode width and electrode spacing.

4. The DNA chip as claimed in claim 2, wherein the electrode width and the electrode spacing lie in the region of 1 μ

m and wherein the reaction layer has a thickness of between 2 and 10 μ

m.

5. The DNA chip as claimed in claim 3, wherein the microelectrode arrangement is a two-pole system, and wherein the reaction layer has a thickness of approximately 3 μ

m.

6. The DNA chip as claimed in claim 3, wherein the microelectrode arrangement is a four-pole system, and wherein the reaction layer has a thickness of approximately 7 μ

m.

7. The DNA chip as claimed in claim 1, wherein the reaction layer is thermally stable up to approximately 95°

C.

8. The DNA chip as claimed in claim 1, wherein the reaction layer contains coupling groups for the covalent binding of catcher molecules.

9. The DNA chip as claimed in claim 1, wherein the reaction layer is a hydrogel.

10. The DNA chip as claimed in claim 6, wherein an acrylamide-based radical-crosslinkable hydrogel includes at least one of maleic anhydride and glycidyl (meth)acrylate as coupling groups.

11. The DNA chip as claimed in claim 1, wherein the electrode arrangement is an interdigital electrode arrangement.

12. The DNA chip as claimed in claim 11, wherein the interdigital electrode arrangement is a two-pole microelectrode system.

13. The DNA chip as claimed in claim 11, wherein the interdigital electrode arrangement is a four-pole microelectrode system.

14. The DNA chip as claimed in claim 1, wherein the flat carrier includes a semiconductor layer and an insulating layer connected thereto, the insulating layer carrying the electrode arrangement and the reaction layer on its side remote from the semiconductor layer.

15. The DNA chip as claimed in claim 14, wherein the semiconductor layer is a silicon layer.

16. The DNA chip as claimed in claim 3, wherein the electrode width and the electrode spacing lie in the region of 1 μ

m and wherein the reaction layer has a thickness of between 2 and 10 μ

m.

17. The DNA chip as claimed in claim 2, wherein the reaction layer is thermally stable up to approximately 95°

C.

18. The DNA chip as claimed in claim 2, wherein the reaction layer contains coupling groups for the covalent binding of catcher molecules.

19. The DNA chip as claimed in claim 2, wherein the reaction layer is a hydrogel.

20. The DNA chip as claimed in claim 2, wherein the electrode arrangement is an interdigital electrode arrangement.