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Stacked ball grid array packages

  • US 20060138630A1
  • Filed: 12/21/2005
  • Published: 06/29/2006
  • Est. Priority Date: 12/28/2004
  • Status: Abandoned Application
First Claim
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1. A stacked arrangement of ball grid array (BGA) packages, the arrangement comprising:

  • a flexible circuit board having first and second opposed surfaces, a central portion, and a side portion extending from each of two opposed sides of the central portion;

    a first array of contact pads on the first surface of the flexible circuit board and in the central portion thereof;

    a second array of contact pads on the second surface of the flexible circuit board and in the central portion thereof;

    a lower array of contact pads on the first surface of the flexible circuit board in each of the side portions thereof;

    a first BGA package having an upper array of solder ball pins on a first surface thereof, each pin in the upper array of pins being fixed to a corresponding one of the contact pads in the first array of contact pads; and

    a second BGA package having first and second opposed surfaces and a middle array of solder ball pins on the first surface thereof, each pin in the middle array of pins being fixed to a corresponding one of the contact pads in the second array of contact pads;

    wherein side portions of the flexible circuit board are folded around the second BGA package so as to be fixed, at the second surface thereof, to the second surface of the second BGA package, whereby the lower array of contact pads is exposed for attachment to a mother board.

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