Micromechanical getter anchor

• US 20060138642A1
• Filed: 01/31/2006
• Published: 06/29/2006
• Est. Priority Date: 11/30/2000
• Status: Abandoned Application

• Current Assignee: Edward Carl Fisher, Jack C. Smith, Joyce Wong Holton, Jwei Wien Liu, Roger A. Robbins
• Original Assignee: Edward Carl Fisher, Jack C. Smith, Joyce Wong Holton, Jwei Wien Liu, Roger A. Robbins
• Inventors: Fisher, Edward Carl, Robbins, Roger A., Liu, Jwei Wien, Smith, Jack C., Holton, Joyce Wong
• Application Number:
  US11/343,395
• Publication Number:
  US 20060138642A1
• Time in Patent Office: Days
• US Class Current: 257/704
• CPC Class Codes: B81B 2203/0307 Anchors
• CPC Class Codes: B81B 7/0038 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: G02B 26/0833 the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD G02B26/0825 takes precedence; micromechanical devices in general B81B
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/484 Connecting portions
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/48997 Reinforcing structures
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/26 including materials for absorbing or reacting with moisture or other undesired substances , e.g. getters
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H04N 5/7458 : the modulator being an array of deformable mirrors, e.g. digital micromirror device [DMD]

Abstract

One embodiment provides an anchor to hold getter materials in place within a micromechanical device package substrate, said anchor comprising: a first cavity face; and a second cavity face. The cavity faces define an anchor cavity and mechanically retain a getter away from a region holding the micromechanical device. Another embodiment provides an anchor to hold a getter in place within a micromechanical device package. The anchor comprises: a package substrate; and a member attached to the package substrate, the member shaped to provide mechanical retention of the getter material formed over said member. Another embodiment provides a micromechanical device package comprising: a package substrate; a package lid enclosing a package cavity; a micromechanical device in the package cavity; and a getter anchor in the package cavity. Other embodiments provide methods of packaging and forming packages having a getter anchor. One getter anchor is formed in a substrate 906 comprised of at least three layers. The layers form a cavity in the substrate 906 with a wide bottom portion-formed in the middle layer 902 and a relatively narrower top portion-formed by the top layer 904. The narrow portion helps to retain the getter in the cavity by creating a mechanical lock on the wide portion of getter in the bottom of the cavity. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. § 1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

Claims

1-18. -18. (canceled)

19. An anchor to hold material in place within a micromechanical device package, said anchor comprising:

a package substrate; and

a member attached to said package substrate, said member shaped to provide mechanical retention of said material formed over said member.

20. The anchor of claim 19, said member comprising:

at least one elongated member attached to said package substrate.

21. The anchor of claim 19, said member comprising:

at least one elongated member attached to said package substrate by one point.

22. The anchor of claim 19, said member comprising:

at least one elongated member attached to said package substrate by one end.

23. The anchor of claim 19, said member comprising:

at least one elongated member attached to said package substrate by at least two points.

24. The anchor of claim 19, said member comprising:

at least one elongated member attached to said package substrate by at least two ends.

25. The anchor of claim 19, said member comprising:

at least one elongated member attached to said package substrate though an intermediate bond pad.

26. The anchor of claim 19, said member comprising:

at least one wire member attached to said package substrate.

27. The anchor of claim 19, said member comprising:

at least one bond wire member attached to said package substrate.

28. A micromechanical device package comprising:

a package substrate;

a package lid enclosing a package cavity;

a micromechanical device in said package cavity; and

a getter anchor in said package cavity.

29. The micromechanical device package of claim 28, wherein said getter anchor comprises at least one member attached to said package substrate.

30. The micromechanical device package of claim 28, wherein said member is attached to said package substrate by one point.

31. The micromechanical device package of claim 28, wherein said member is attached to said package substrate by one end.

32. The micromechanical device package of claim 28, wherein said member is attached to said package substrate by at least two points.

33. The micromechanical device package of claim 28, wherein said member is attached to said package substrate by at least two ends.

34. The micromechanical device package of claim 28, wherein said member is attached to said package substrate though an intermediate bond pad.

35. The micromechanical device package of claim 28, wherein said member is a wire.

36. The micromechanical device package of claim 28, wherein said member is a bond wire.

37. The micromechanical device package of claim 28, wherein said anchor is a cavity anchor.

38. The micromechanical device package of claim 28, wherein said cavity anchor is formed in said package substrate.

39. The micromechanical device package of claim 28, wherein said cavity anchor is a slot formed in said package substrate.

40. The micromechanical device package of claim 28, wherein said slot has a narrow top and a wider bottom portion.

41. The micromechanical device package of claim 28, said cavity anchor formed to provide mechanical retention of a getter material.

42. A method of packaging a micromechanical device, said method comprising:

providing a package substrate having a getter anchor;

attaching a micromechanical device to said package substrate;

attaching a getter material to said getter anchor; and

attaching a package lid to said package substrate.

43. The method of claim 42, wherein providing a package substrate having a getter anchor comprises:

providing a ceramic package substrate having an anchor cavity formed therein.

44. The method of claim 42, wherein providing a package substrate having a getter anchor comprises:

providing a package substrate having at least one member attached thereto, said member forming said getter anchor.

45. The method of claim 42, wherein providing a package substrate having a member attached thereto comprises:

attaching at least one elongated member to said package substrate.

46. The method of claim 42, wherein providing a package substrate having a member attached thereto comprises:

attaching at least one mushroom shaped member to said package substrate.

47. The method of claim 42, wherein providing a package substrate having a member attached thereto comprises:

attaching at least one wire to said substrate.

48. The method of claim 42, wherein providing a package substrate having a member attached thereto comprises:

attaching at least one wire loop to said substrate.

49. The method of claim 42, wherein providing a package substrate having a member attached thereto comprises:

providing a package substrate having a member attached to a bond pad of said substrate.

50. The method of claim 42, wherein attaching a getter material to said getter anchor comprises:

putting a getter material into an anchor cavity.

51. The method of claim 42, wherein attaching a getter material to said getter anchor comprises:

putting a desiccant material into an anchor cavity.

52. The method of claim 42, wherein attaching a getter material to said getter anchor comprises:

putting a molecular sieve material into an anchor cavity.

53. The method of claim 42, wherein attaching a getter material to said getter anchor comprises:

putting a getter mixed with a carrier material into an anchor cavity.

54. The method of claim 42, wherein attaching a getter material to said getter anchor comprises:

putting a getter mixed with a solvent material into an anchor cavity.

55. The method of claim 42, wherein attaching a getter material to said getter anchor comprises:

putting a getter mixed with a lubricant into an anchor cavity.

56. The method of claim 42, wherein attaching a getter material to said getter anchor comprises:

attaching a desiccant material to said anchor.

57. The method of claim 42, wherein attaching a getter material to said getter anchor comprises:

attaching a molecular sieve material to said anchor.

58. The method of claim 42, wherein attaching a getter material to said getter anchor comprises:

attaching a getter mixed with a carrier material to said anchor.

59. The method of claim 42, wherein attaching a getter material to said getter anchor comprises:

attaching a getter mixed with a solvent material to said anchor.

60. The method of claim 42, wherein attaching a getter material to said getter anchor comprises:

attaching a getter mixed with a lubricant to said anchor.

61. The method of claim 42, wherein attaching a getter material to said getter anchor comprises:

attaching an adhesive to said anchor; and

attaching a getter to said adhesive.

62. The method of claim 42, wherein attaching a getter material to said getter anchor comprises:

attaching an adhesive to said anchor; and

attaching a preformed getter to said adhesive.

63. A method of forming a package having an anchor, said method comprising:

forming a first package substrate layer;

forming a second package substrate layer, said second layer having a void;

forming a third package substrate layer;

laminating said first, second, and third layers such that said void forms an anchor cavity suitable for anchoring a getter.

64. The method of claim 63, further comprising:

forming a fourth package substrate layer, said fourth package substrate layer having a void, wherein said second and fourth layers are adjacent when said layers are laminated such that a cavity anchor with a narrow top and a relatively wide bottom is formed by said voids in said second and fourth layers.

65. A method of packaging a micromechanical device, said method comprising:

providing a package substrate;

attaching a micromechanical device to said package substrate;

attaching bond wires between said micromechanical device and said package substrate;

attaching a getter material to said bond wires; and

attaching a package lid to said package substrate.

66. The method of claim 65, wherein attaching a getter material to said getter anchor comprises:

attaching an adhesive to said bond wires; and

attaching a getter to said adhesive.

67. The method of claim 65, wherein attaching a getter material to said getter anchor comprises:

attaching an adhesive to said bond wires; and

attaching a preformed getter to said adhesive.