Native incorporation of RF ID technology for the tracking of electronic circuitry

• US 20060138651A1
• Filed: 12/28/2004
• Published: 06/29/2006
• Est. Priority Date: 12/28/2004
• Status: Abandoned Application

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Walko, Joseph P.
• Application Number:
  US11/024,321
• Publication Number:
  US 20060138651A1
• Time in Patent Office: Days
• US Class Current: 257/728
• CPC Class Codes: H01L 2223/5444 for electrical read out
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

RF ID transmitter circuits are integrated into semiconductor chips during fabrication of the regular integrated circuits therein for providing identification capabilities for the semiconductor chips that comply with the IEEE family of standards 802. The RF ID transmitter circuit enables each chip to be identified in many different environments and at any of the stages after its fabrication, including inspection, distribution and commercial usage of the chip.

Claims

1. A semiconductor chip comprising:

an integrated circuit (IC) fabricated on a substrate; and

RF ID (identification) circuitry fabricated on said substrate during fabrication of the IC, wherein a portion of said RF ID circuitry emits an RF signal to identify said semiconductor chip, said RF ID circuitry complying with an IEEE family of standards 802 for local area networks (LANs) and metropolitan area networks (MANs).

2. The semiconductor chip of claim 1, wherein said RF ID circuitry complies with the IEEE family of standards 802 and employs unique local area network media access control (LAN MAC) addresses, group addresses, and protocol identifiers.

3. The semiconductor chip of claim 2, wherein said RF ID circuitry complies with the IEEE family of standards 802 and includes a unique Organizationally Unique Identifier (OUI) to an organization.

4. The semiconductor chip of claim 3, wherein said RF ID circuitry complies with the IEEE family of standards 802 and employs protocol identifiers that are five octets (40 bits) in length, with the first three octets of the protocol identifier consisting of said OUI.

5. The semiconductor chip of claim 4, wherein said OUI is three octets (24 bits) in length, wherein the second least significant bit (LSB) is always a zero (0).

6. The semiconductor chip of claim 5, wherein the semiconductor chip is packaged in a multi-chip package.

7. The semiconductor chip of claim 1, wherein said RF ID circuitry complies with the IEEE family of standards 802 and includes a unique Organizationally Unique Identifier (OUI) to an organization.

8. The semiconductor chip of claim 1, wherein said RF ID circuitry complies with the IEEE family of standards 802 and employs protocol identifiers that are five octets (40 bits) in length, with the first three octets of the protocol identifier consisting of an OUI.

9. The semiconductor chip of claim 1, wherein said RF ID circuitry complies with the IEEE family of standards 802 and includes a unique Organizationally Unique Identifier (OUI) to an organization that is three octets (24 bits) in length, wherein the second least significant bit (LSB) is always a zero (0).

10. The semiconductor chip of claim 1, wherein the semiconductor chip is packaged in a multi-chip package.

11. A method of fabricating a semiconductor chip comprising:

fabricating an integrated circuit (IC) on a substrate; and

simultaneously fabricating RF ID (identification) circuitry on said substrate during fabrication of the IC, wherein a portion of said RF ID circuitry emits an RF signal to identify said semiconductor chip, said RF ID circuitry complying with an IEEE family of standards 802 for local area networks (LANs) and metropolitan area networks (MANs) and including a unique Organizationally Unique Identifier (OUI) to an organization which is three octets (24 bits) in length, wherein the second least significant bit (LSB) is always a zero (0).

12. The method of claim 11, including packaging the semiconductor chip in a multi-chip package.

13. A method of identifying a semiconductor chip comprising:

fabricating the semiconductor chip with an integrated circuit (IC) and RF ID (identification) circuitry, wherein a portion of said RF ID circuitry emits an RF signal to identify said semiconductor chip, said RF ID circuitry complying with an IEEE family of standards 802 for local area networks (LANs) and metropolitan area networks (MANs) and including a unique Organizationally Unique Identifier (OUI) to an organization which is three octets (24 bits) in length, wherein the second least significant bit (LSB) is always a zero (0).

14. The method of claim 13, including utilizing the RF ID circuitry for determining the presence and identity of chips within a multi-chip package.

15. The method of claim 13, including performing an information processing (IP) search for chips with embedded RF IDs at any of the stages after their fabrication, including inspection, distribution and commercial usage of the chips.

16. The method of claim 13, wherein RF ID scanning equipment irradiates and scans the chip with an RF signal causing the RF ID circuitry to emit an RF signal that is used to identify the semiconductor chip.