Method and device for structuring organic layers

• US 20060138701A1
• Filed: 06/30/2004
• Published: 06/29/2006
• Est. Priority Date: 07/03/2003
• Status: Abandoned Application

• Current Assignee: PolyIC GmbH & Co. KG (Leonhard KURZ Stiftung & Company KG)
• Original Assignee: PolyIC GmbH & Co. KG (Leonhard KURZ Stiftung & Company KG)
• Inventors: Fix, Walter, Ullmann, Andreas, Ficker, Jurgen
• Application Number:
  US10/562,989
• Publication Number:
  US 20060138701A1
• Time in Patent Office: Days
• US Class Current: 264/284
• CPC Class Codes: B29C 59/046 for layered or coated substantially flat surfaces
• CPC Class Codes: H05K 2203/0108 Male die used for patterning, punching or transferring
• CPC Class Codes: H05K 2203/0143 Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
• CPC Class Codes: H05K 2203/1189 Pressing leads, bumps or a die through an insulating layer
• CPC Class Codes: H05K 3/005 Punching of holes
• CPC Class Codes: H10K 71/20 Changing the shape of the active layer in the devices, e.g. patterning
• CPC Class Codes: H10K 71/236 using printing techniques, e.g. applying the etch liquid using an ink jet printer

Abstract

An unpatterned organic layer, which may be an insulator layer of an organic circuit, is patterned with a patterning arrangement, which preferably comprises a device, which patterns the layer at a predetermined temperature and at a predetermined pressure (a compression pressure) into the organic layer. The applying operation permanently patterns the organic layer with the patterning arrangement displaces the contact region of the organic layer displacing the contact region to form permanent open regions comprising depressions and/or holes corresponding to the dimensions of the pattern arrangement and which may be utilized as plated through holes.

Claims

1. A method for patterning an unpatterned organic layer comprising a layer-forming substance for use in organic circuits, the method comprising:

applying a patterning device at a predetermined, elevated temperature and at a predetermined pressure to contact points on the organic layer, the layer-forming substance of the organic layer retreating from the contact points in response to the applied pressure and elevated temperature to thereby form depressions and/or holes in the organic layer.

2. The method as claimed in claim 1, including choosing a the substance which forms the organic layer such that the organic layer is opened permanently under the applying action of the patterning device.

3. The method as claimed in claim 1 including effecting the applying step over a predetermined time period.

4. The method as claimed in claim 1 including supporting the patterning device on a planar carrier.

5. The method as claimed in claim 1 including forming the patterned organic layer depressions and/or in accordance with a pattern on the patterning device.

6. The method as claimed in claim 5, including providing a further layer covered by the organics layer, the depressions and/or holes essentially extending continuously to the further layer.

7. The method as claimed in claim 5 wherein including forming the depressions and/or holes for forming plated-through holes.

8. A device for patterning an organic layer comprising a layer-forming substance for use in an organic circuits, the device comprising:

a support; and

a patterning arrangement coupled to the support and having predetermined dimensions, the patterning arrangement being arranged for being heated to a predetermined elevated temperature and for receiving a predetermined pressure for containing the layer-forming substance of the organic layer at the elevated temperature and predetermined pressure to displace the layer-forming substance such that depressions and/or holes are formed in the layer-forming substance, which depressions and/or holes essentially correspond to the dimensions of the patterning arrangement.

9. The device as claimed in claim 8 wherein, the layer-forming substance which forms the organic layer is opened permanently under the action of the patterning arrangement.

10. The device as claimed in claim 8 wherein the support comprises a planar carrier.

11. The device as claimed in claim 8 wherein the support is a planar, flexible carrier, which is arranged circumferentially on a roll-type carrier.

12. The device as claimed in claim 11 wherein the roll-type carrier has a circumferential speed, the device including a conveying device for conveying the organic layer essentially synchronously with the circumferential speed of the roll-type carrier.

13. The device as claimed in claim 8 including a further device for pressing the patterning arrangement into the organic layer at the predetermined pressure.

14. The device as claimed in claim 8 including a further device for heating the

patterning arrangement to the predetermined temperature.