In situ optical surface temperature measuring techniques and devices

• US 20060140248A1
• Filed: 02/24/2006
• Published: 06/29/2006
• Est. Priority Date: 04/20/2001
• Status: Active Grant

• Current Assignee: LumaSense Technologies Holdings, Inc. (Advanced Energy Industries, Inc. (China))
• Original Assignee: Luxtron Corp. (Advanced Energy Industries, Inc. (China))
• Inventors: Gotthold, John P., Champetier, Robert, Stapleton, Terry M., Dang, Hung
• Granted Patent: US 7,374,335 B2
• Time in Patent Office: Days
• US Class Current: 374/161
• CPC Class Codes: G01J 1/28 using variation of intensity or distance of source G01J1/34 takes precedence
• CPC Class Codes: G01J 1/58 using luminescence generated by light
• CPC Class Codes: G01J 5/0003 for sensing the radiant heat transfer of samples, e.g. emittance meter
• CPC Class Codes: G01J 5/0007 of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
• CPC Class Codes: G01J 5/02 Constructional details
• CPC Class Codes: G01J 5/0205 Mechanical elements; Supports for optical elements
• CPC Class Codes: G01J 5/025 Interfacing a pyrometer to an external device or network; User interface
• CPC Class Codes: G01J 5/046 Materials; Selection of thermal materials
• CPC Class Codes: G01J 5/048 Protective parts
• CPC Class Codes: G01J 5/08 Optical arrangements
• CPC Class Codes: G01J 5/0818 Waveguides
• CPC Class Codes: G01J 5/0821 Optical fibres
• CPC Class Codes: G01J 5/084 Adjustable or slidable
• CPC Class Codes: G01J 5/0887 Integrating cavities mimicking black bodies, wherein the heat propagation between the black body and the measuring element does not occur within a solid; Use of bodies placed inside the fluid stream for measurement of the temperature of gases; Use of the reemission from a surface, e.g. reflective surface; Emissivity enhancement by multiple reflections
• CPC Class Codes: G01J 5/0893 Arrangements to attach devices to a pyrometer, i.e. attaching an optical interface; Spatial relative arrangement of optical elements, e.g. folded beam path G01J5/049 takes precedence
• CPC Class Codes: G01K 1/14 Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
• CPC Class Codes: G01K 1/16 Special arrangements for conducting heat from the object to the sensitive element
• CPC Class Codes: G01K 11/20 using thermoluminescent materials G01K11/32 takes precedence
• CPC Class Codes: G01K 11/3206 at discrete locations in the fibre, e.g. using Bragg scattering
• CPC Class Codes: G01K 11/3213 using changes in luminescence, e.g. at the distal end of the fibres

Abstract

A temperature sensor that has a thermally conducting contact with a surface that emits electromagnetic radiation in proportion to the temperature of the contact is disclosed. The sensor has a resilient member attached to the contact and configured to extend the contact toward the object to be measured. A first light waveguide is attached to the contact and is configured to transmit the electromagnetic radiation from the contact. The sensor has a guide with a bore formed therein that the first waveguide is insertable into. When the contact is moved, the first waveguide moves within the bore. A second waveguide is attached to the guide such that a variable gap is formed between the ends of the first waveguide and the second waveguide. Electromagnetic energy from the first waveguide traverses the gap and can be transmitted by the second waveguide. The guide allows the first waveguide to move with the contact in order to ensure that the contact is fully engaged with the surface of the object.

Claims

1-58. -58. (canceled)

59. A luminescent temperature sensor comprising:

a test substrate, said test substrate having a surface, said surface having a recess therein;

a layer of luminescent material, disposed in the recess, that emits electromagnetic radiation having a detectable optical characteristic functionally dependent on the temperature of the test substrate; and

a light waveguide in optical communication with the layer of luminescent material.

60. The luminescent temperature sensor of claim 59, further comprising an optical connector in optical communication with the light waveguide and configured to transmit the electromagnetic radiation from the light waveguide.

61. The luminescent temperature sensor of claim 59, being configured to measure the temperature of a process selected from the group consisting of:

physical vapor deposition;

dielectric etching;

optical coating of glass substrates;

chemical vapor deposition;

metal organic vapor deposition;

sputtering;

vaporization;

low pressure chemical vapor deposition; and

atomic layer deposition.

62. The luminescent temperature sensor of claim 59, wherein the layer of luminescent material surface has a known emissivity and emits radiation within an infrared range.

63. The luminescent temperature sensor of claim 59, wherein the test substrate is a semiconductor wafer or a flat panel display.

64. The luminescent temperature sensor of claim 59, wherein the layer of luminescent material is wholly contained within the recess.

65. The luminescent temperature sensor of claim 64, wherein the layer of luminescent material is sealed within the recess.

66. The luminescent temperature sensor of claim 65, wherein the test substrate includes an optical window that seals said layer of luminescent material in the recess.

67. The luminescent temperature sensor of claim 66, wherein the optical window is wholly contained within the recess.

68. The luminescent temperature sensor of claim 66, wherein the optical window is spatially removed from the light waveguide such that the optical window is not in physical contact with the light waveguide.

69. The luminescent temperature sensor of claim 66, wherein the optical window is made of sapphire.

70. The luminescent temperature sensor of claim 66, the sensor further comprising a source of excitation radiation and wherein excitation radiation is passed through the optical window by said source of excitation radiation and said layer of luminescent material emits said electromagnetic radiation having said detectable optical characteristic in response to said excitation radiation.

71. The luminescent temperature sensor of claim 59, wherein the sensor is disposed within a heating chamber.

72. The luminescent temperature sensor of claim 59, wherein the sensor is disposed within a general vacuum processing chamber.

73. The luminescent temperature sensor of claim 59, further comprising:

a support that supports said test substrate and wherein the light waveguide is disposed within the support.

74. The luminescent temperature sensor of claim 73, wherein the test substrate is horizontally supported by the support.

75. The luminescent temperature sensor of claim 73, wherein the support is a chuck that is cooled by circulation of a coolant through the chuck from an outside supply of coolant.

76. The luminescent temperature sensor of claim 73, wherein the support is a chuck.

77. The luminescent temperature sensor of claim 73, wherein the test substrate is vertically supported by the support.

78. The luminescent temperature sensor of claim 59, wherein the test substrate is heated by a radiant heater.

79. The luminescent temperature sensor of claim 59, further comprising:

a photodetector in optical communication with the light waveguide; and

a measuring circuit card or instrument in electrical communication with the photodetector, the measuring circuit card or instrument configured to provide an output signal of a measured temperature of the test substrate.

80. The luminescent temperature sensor of claim 59, wherein the luminescent temperature sensor measures a temperature of the surface of the test substrate.

81. A test device for measuring a temperature in a processing step, the test device comprising:

a test substrate, said test substrate having a surface, said surface having a recess therein;

a layer of luminescent material wholly contained in the recess, wherein the luminescent material emits electromagnetic radiation having a detectable optical characteristic that is functionally dependent on the temperature of the test substrate in response to a source of excitation radiation; and

an optical window that seals said layer of luminescent material in the recess in the surface of the substrate.

82. The test device of claim 81, wherein the test substrate is a semiconductor wafer shape or a flat panel display.

83. The test device of claim 81, wherein the optical window is made of sapphire.

84. The test device of claim 81, wherein the optical window is wholly contained within the recess.

85. The test device of claim 81, wherein the processing step is selected from the group consisting of:

physical vapor deposition;

dielectric etching;

optical coating of glass substrates;

chemical vapor deposition;

metal organic vapor deposition;

sputtering;

vaporization;

low pressure chemical vapor deposition; and

atomic layer deposition.

86. The test device of claim 81, wherein the layer of luminescent material has a known emissivity and emits radiation within an infrared range.

87. A supporting device for supporting a test substrate having a surface with a recess, comprising:

a support;

a source of excitation radiation disposed in the support, the source of excitation radiation configured to pass excitation radiation to a layer of luminescent material; and

a waveguide disposed in the support, wherein the waveguide is in optical communication with a layer of luminescent material and the waveguide is configured to measure temperature dependent luminescent radiation emitted by a layer of luminescent material.

88. The support of claim 87, further including an optical connector in optical communication with the waveguide and configured to transmit the temperature dependent luminescent radiation emitted by a layer of luminescent material from the waveguide.

89. The support of claim 87, wherein the support is a chuck.

90. The support of claim 87, wherein the support horizontally or vertically supports a test substrate.

91. A vacuum processing chamber for performing a processing step, the vacuum processing chamber comprising:

a chamber;

a test substrate, said test substrate having a surface, said surface having a recess therein;

a layer of luminescent material wholly contained within the recess of the test substrate, wherein the luminescent material emits electromagnetic radiation having a detectable optical characteristic that is functionally dependent on the temperature of the test substrate in response to a source of excitation radiation;

a support disposed within the chamber, the support horizontally or vertically supporting the test substrate;

a source of excitation radiation disposed in the support, the source of excitation radiation configured to pass excitation radiation to the layer of luminescent material within the recess of the test substrate; and

a waveguide disposed in the support, the waveguide in optical communication with the layer of luminescent material, wherein the waveguide is configured to measure temperature dependent luminescent radiation emitted by the layer of luminescent material.

92. The vacuum processing chamber of claim 91, wherein the test substrate includes an optical window that seals said layer of luminescent material in the recess.

93. The vacuum processing chamber of claim 92, wherein the optical window is wholly contained within the recess.

94. The vacuum processing chamber of claim 92, wherein the optical window is spatially removed from both the waveguide and the source of excitation radiation such that the optical window is not in physical contact with the waveguide and the source of excitation radiation.

95. The vacuum processing chamber of claim 91, wherein the processing step is selected from the group consisting of:

physical vapor deposition;

dielectric etching;

optical coating of glass substrates;

chemical vapor deposition;

metal organic vapor deposition;

sputtering;

vaporization;

low pressure chemical vapor deposition; and

atomic layer deposition.

96. The vacuum processing chamber of claim 91, wherein the support is a chuck.