Contact image sensing module with movement detecting function

• US 20060140459A1
• Filed: 10/28/2005
• Published: 06/29/2006
• Est. Priority Date: 12/24/2004
• Status: Active Grant

• Current Assignee: Dyna Image Corp. (Diodes Incorporated)
• Original Assignee: Lite-On Semiconductor Corporation (Lite-On Technology Corporation)
• Inventors: Cheng, Chia-Chu, Wang, Ming-Ho
• Granted Patent: US 7,381,941 B2
• Time in Patent Office: Days
• US Class Current: 382/124
• CPC Class Codes: G06V 40/1335 Combining adjacent partial images (e.g. slices) to create a composite input or reference pattern; Tracking a sweeping finger movement
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 3/4691 Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Abstract

A contact image sensing module with movement detecting function has a main circuit substrate, a linear sensor array, at least a movement detecting element, a light source, a light-guiding device, and a detecting surface. The main substrate is a flex-rigid composite substrate having a structure making the linear sensor array have a tilted angle. The linear sensor array has at least a comparison sensor corresponding to at least a movement detecting element. The movement detecting element and the comparison sensor, respectively, draw a section of reference image data and a section of comparison image data from a sensed object. After processing a shift-times deciding equation and a speed deciding equation, the moving speed of the sensed object relating to the movement detecting element and the comparison sensor can be obtained. The structure of the light-guiding device makes the light from the light source to the sensed object more uniform.

Claims

1. A contact image sensing module with a movement detecting function, comprising:

a main circuit substrate;

a linear sensor array mounted on the main circuit substrate;

at least a movement detecting element mounted on the main circuit substrate and parallel-arranged at one side of the linear sensor array;

a light source; and

a detecting surface defined at one side of the linear sensor array and the at least a movement detecting element,

wherein the detecting surface is used for placement of a sensed object thereon, a light from the light source is transmitted to the detecting surface, and the light is then reflected by the sensed object to the linear sensor array and the at least a movement detecting element.

2. The sensing module according to claim 1, wherein the main circuit substrate is a flex-rigid composite substrate comprising a first rigid circuit substrate, a second rigid circuit substrate, a third rigid circuit substrate, and at least a flex circuit board, wherein the first rigid circuit substrate, the second rigid circuit substrate and the third rigid circuit substrate are electrically connected to the at least a flex circuit board so as to form, respectively, a first composite substrate, a second composite substrate and a third composite substrate, the second composite substrate and the third composite substrate are respectively tilted upward a predetermined angle relating to the first composite substrate, the linear sensor array and the at least a movement detecting element are mounted on the second composite substrate, and the light source is mounted on the third composite substrate.

3. The sensing module according to claim 2, wherein the first composite substrate, the second composite substrate, and the third composite substrate respectively have plural through holes and plural conducting elements mounted therein, wherein each conducting element is mounted on an inner surface of each corresponding through hole and is electrically connected to the first rigid circuit substrate and the at least a flex circuit board, the second rigid circuit substrate and the at least a flex circuit board, and the third rigid circuit substrate and the at least a flex circuit board.

4. The sensing module according to claim 2, wherein the second composite substrate is upward tilted by 45°

relative to the first composite substrate.

5. The sensing module according to claim 2, wherein the third composite substrate is upward tilted through 90°

relative to the first composite substrate.

6. The sensing module according to claim 2, wherein the linear sensor array and the at least a movement detecting element are electrically connected to the second rigid circuit substrate in a COB (chip-on-board) manner.

7. The sensing module according to claim 2, wherein the light source is electrically connected to the third rigid circuit substrate in a COB manner.

8. The sensing module according to claim 2, wherein the main circuit substrate is a flex-rigid composite substrate comprising a first rigid circuit substrate, a second rigid circuit substrate, and at least a flex circuit board, wherein the first rigid circuit substrate and the second rigid circuit substrate are electrically connected to the at least a flex circuit board so as to form, respectively, a first composite substrate and a second composite substrate, the second composite substrate is tilted upward by a predetermined angle relating to the first composite substrate, the linear sensor array and the at least a movement detecting element are mounted on the second composite substrate, and the light source is mounted on the third composite substrate.

9. The sensing module according to claim 8, wherein the first composite substrate and the second composite substrate respectively have plural through holes and plural conducting elements mounted thereon, wherein each conducting element is mounted on an inner surface of each corresponding through hole and is electrically connected to the first rigid circuit substrate and the at least a flex circuit board, and the second rigid circuit substrate and the at least a flex circuit board.

10. The sensing module according to claim 8, wherein the second composite substrate is upward tilted by 45°

relating to the first composite substrate.

11. The sensing module according to claim 8, wherein the linear sensor array and the at least a movement detecting element are electrically connected to the second rigid circuit substrate in a COB (chip-on-board) manner.

12. The sensing module according to claim 8, wherein the light source is electrically connected to the first rigid circuit substrate in a DIP (Dual-In-Line-Package) manner.

13. The sensing module according to claim 1, wherein the linear sensor array has plural contact image sensors, and at least one of the image sensing elements is corresponded to the at least a movement detecting element and is defined as at least a comparison sensing element.

14. The sensing module according to claim 1, wherein the linear sensor array has plural contact image sensors, and the at least a movement detecting element is a contact image sensor.

15. The sensing module according to claim 1, wherein the light source is a light-emitting diode.

16. The sensing module according to claim 1, further comprising a light-guiding device, wherein the light-guiding device is axially parallel to the linear sensor array, and an end of the light-guiding device is adjacent to the light source.

17. The sensing module according to claim 16, further comprising a focusing device axially parallel to the linear sensing sensor array and located between the light-guiding device and the linear sensor array.

18. The sensing module according to claim 17, wherein the focusing device is a lens.

19. The sensing module according to claim 17, wherein the light-guiding device has a reflection surface and a light-output surface formed along an axial direction thereof, wherein detection is defined at the reflecting surface and the light-output surface corresponds to the focusing device.