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MEMS device package and method for manufacturing the same

  • US 20060141650A1
  • Filed: 11/10/2005
  • Published: 06/29/2006
  • Est. Priority Date: 12/27/2004
  • Status: Active Grant
First Claim
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1. A micro electromechanical system (MEMS) device package comprising:

  • a device substrate with a MEMS active device being formed on a top surface thereof;

    internal electrode pads, each of which is positioned on the opposite side of the MEMS active device and comprises first and second pads arranged opposite to each other with a clearance therebetween;

    sealing pads positioned outside of the internal electrode pads;

    a closure substrate joined to the device substrate through the sealing pads, the closure substrate comprising via holes formed at the areas where the internal electrode pads are positioned;

    connection members, each of which is formed on the inner surfaces of the via holes to be in contact with the internal electrode pads at one ends thereof; and

    external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are in contact with the other ends of the connection members.

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