×

Method of manufacturing an electronic device and electronic device

  • US 20060141786A1
  • Filed: 02/10/2004
  • Published: 06/29/2006
  • Est. Priority Date: 02/11/2003
  • Status: Abandoned Application
First Claim
Patent Images

1. A method of manufacturing an electronic device, comprising:

  • providing a wafer (10) with a first and an opposed second side, having first and second semiconductor layers (12, 16) with at least a layer of insulating material (14) therebetween, at which first side a semiconductor circuit is provided comprising semiconductor elements that are defined in the first semiconductor layer;

    forming a micro-electromechanical systems (MEMS) device comprising a movable electrode and a reference electrode in said wafer by etching trenches according to a desired pattern extending substantially perpendicularly to a plane in the wafer, and releasing the movable electrode in that the trenches extend to the layer of insulating material that is selectively removed, characterized in that said MEMS device is formed in said second semiconductor layer (12) in that the trenches are etched from the second side of the wafer down to the layer of insulating material.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×