Non-resonant antennas embedded in wireless peripherals
First Claim
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1. A peripheral apparatus for generating and transmitting radio frequency (RF) control signals to a host device, the peripheral apparatus comprising:
- a housing;
a semiconductor device contained within the housing and that generates the RF control signals; and
an antenna fully contained within the semiconductor device for transmitting the RF control signals to the host device.
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Abstract
A peripheral apparatus includes a housing, a semiconductor device, and an antenna. The peripheral apparatus generates and transmits radio frequency (RF) control signals to a host device. The semiconductor device is contained within the housing and generates the RF control signals. The antenna is fully contained within the semiconductor device and transmits the RF control signals to the host device.
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Citations
20 Claims
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1. A peripheral apparatus for generating and transmitting radio frequency (RF) control signals to a host device, the peripheral apparatus comprising:
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a housing;
a semiconductor device contained within the housing and that generates the RF control signals; and
an antenna fully contained within the semiconductor device for transmitting the RF control signals to the host device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A peripheral apparatus comprising:
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a peripheral apparatus housing; and
a semiconductor device mounted within the peripheral apparatus housing for generating and sending radio frequency (RF) control signals to a host device, the semiconductor device further comprising;
a leadframe;
a plurality of semiconductor layers;
a plurality of metallization layers;
an antenna; and
a plastic housing containing the leadframe, the plurality of semiconductor layers, and the antenna. - View Dependent Claims (14, 15, 16, 17)
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18. A method for fabricating a semiconductor device for use in a peripheral device that generates and sends radio frequency (RF) control signals to a host device, the method comprising:
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providing a leadframe;
attaching a semiconductor chip with layers of semiconductor material onto the leadframe;
providing metallization layers;
fabricating an antenna; and
encapsulating the leadframe, the semiconductor chip, the metallization layers, and the antenna in a plastic housing. - View Dependent Claims (19, 20)
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Specification