Semiconductor sensor

• US 20060144144A1
• Filed: 12/14/2005
• Published: 07/06/2006
• Est. Priority Date: 01/06/2005
• Status: Active Grant

• Current Assignee: Ricoh Company Limited
• Original Assignee: Ricoh Company Limited
• Inventors: Seto, Masami
• Granted Patent: US 7,406,870 B2
• Time in Patent Office: Days
• US Class Current: 73/514.330
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/084 the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass

Abstract

A semiconductor sensor is disclosed that includes a proof mass, a frame that is arranged around the proof mass, a beam that is arranged at the surface side of the frame and is configured to support the proof mass, plural piezo-resistive elements arranged on the beam, plural metal wiring patterns and pad electrodes that are arranged on the surface of the frame and are electrically connected to the piezo-resistive elements, a cover plate that is fixed to the surface of the frame and is arranged to be spaced apart from the proof mass and the beam, and a cover plate fixing region for fixing the cover plate to the surface of the frame, the cover plate fixing region including a formation region for the metal wiring patterns.

Claims

1. A semiconductor sensor comprising:

a proof mass;

a frame that is arranged around the proof mass;

a beam that is arranged at a surface side of the frame and is configured to support the proof mass;

a plurality of piezo-resistive elements arranged on the beam;

a plurality of metal wiring patterns and a plurality of pad electrodes which metal wiring patterns and pad electrodes are arranged on the surface of the frame and are electrically connected to the piezo-resistive elements;

a cover plate that is fixed to the surface of the frame and is arranged to be spaced apart from the proof mass and the beam; and

a cover plate fixing region for fixing the cover plate to the surface of the frame, the cover plate fixing region including a formation region for the metal wiring patterns.

2. The semiconductor sensor as claimed in claim 1,

wherein the cover plate fixing region is arranged to surround the proof mass and the beam.

3. The semiconductor sensor as claimed in claim 2,

wherein the pad electrodes are collectively arranged along one side edge of the frame.

4. The semiconductor sensor as claimed in claim 1,

wherein the cover plate is a transparent glass plate that allows the proof mass and the flexible element to be visible.

5. The semiconductor sensor as claimed in claim 1,

wherein the surface of the frame is made of a silicon layer, and the cover plate is a glass plate that is fixed to the cover plate fixing region-through anodic bonding.

6. The semiconductor sensor as claimed in claim 1,

wherein the cover plate is a welded glass plate that is fixed to the cover plate fixing region through welding.

7. The semiconductor sensor as claimed in claim 1,

wherein the cover plate is fixed to the cover plate fixing region by adhesive.

8. The semiconductor device as claimed in claim 1,

wherein the cover plate fixing region includes a dummy pattern that is simultaneously created with the metal wiring patterns.

9. The semiconductor sensor as claimed in claim 8,

wherein the beam and the surface of the frame are made of a same silicon layer, and the metal wiring patterns and the dummy pattern are arranged on the silicon layer via an insulating film;

and

the dummy pattern is electrically connected to the silicon layer via a through hole that is arranged at the insulating film.