Thermal management apparatus, systems, and methods

• US 20060144619A1
• Filed: 01/06/2005
• Published: 07/06/2006
• Est. Priority Date: 01/06/2005
• Status: Abandoned Application

• Current Assignee: Halliburton Energy Services Incorporated (Halliburton Company)
• Original Assignee: Halliburton Energy Services Incorporated (Halliburton Company)
• Inventors: Jakaboski, Juan-Carlos, Freeman, James J., Joshi, Yogendra, Storm, Bruce H. Jr.
• Application Number:
  US11/030,263
• Publication Number:
  US 20060144619A1
• Time in Patent Office: Days
• US Class Current: 175/17
• CPC Class Codes: E21B 47/017 Protecting measuring instruments
• CPC Class Codes: E21B 47/0175 Cooling arrangements
• CPC Class Codes: H05K 7/20281 Thermal management, e.g. liquid flow control

Abstract

An apparatus and a system, as well as a method and article, may operate to circulate a coolant through a thermal conduit thermally coupled to a chassis heat exchange element including a plurality of receiving sections thermally coupled to a corresponding plurality of electronic devices. The temperature of one or more of the plurality of electronic devices may be sensed, and the flow rate of the coolant adjusted in accordance with the sensed temperature. The thermal conduit may include thermally conductive, flow disrupting elements. The chassis heat exchange element may operate in a downhole environment, including logging and drilling operations.

Claims

1. A method, comprising:

circulating a first coolant through a thermal conduit thermally coupled to a chassis heat exchange element including a plurality of receiving sections thermally coupled to a corresponding plurality of electronic devices;

sensing a temperature of at least one of the plurality of electronic devices; and

adjusting a flow rate of the first coolant in accordance with the temperature.

2. The method of claim 1, further including:

adjusting the flow rate of the first coolant in accordance with a change in a viscosity of the first coolant.

3. The method of claim 1, wherein adjusting the flow rate of the first coolant comprises adjusting the flow rate of the first coolant to a substantially constant flow rate.

4. The method of claim 1, further including:

removing the chassis heat exchange element from a borehole;

removably coupling a charging pump to the thermal conduit; and

circulating a second coolant through the thermal conduit, wherein the second coolant has a second temperature substantially less than a first temperature of the first coolant.

5. The method of claim 1, further including:

replacing a first heat sink thermally coupled to the chassis heat exchange element with a second heat sink having a second temperature substantially less than a first temperature of the first heat sink.

6. The method of claim 1, further including:

adjusting a volume in fluid communication with the conduit to maintain a substantially constant pressure of the coolant.

7. The method of claim 1, further including:

inserting the chassis heat exchange element into a borehole.

8. An article including a machine-accessible medium having associated information, wherein the information, when accessed, results in a machine performing:

circulating a coolant through a thermal conduit thermally coupled to a chassis heat exchange element including a plurality of receiving sections thermally coupled to a corresponding plurality of electronic devices;

sensing a temperature of at least one of the plurality of electronic devices; and

adjusting a flow rate of the coolant in accordance with the temperature.

9. The article of claim 8, wherein the information, when accessed, results in a machine performing:

indicating the temperature.

10. The article of claim 8, wherein the information, when accessed, results in a machine performing:

determining an optimal flow rate associated with the coolant.

11. The article of claim 8, wherein the information, when accessed, results in a machine performing:

increasing the flow rate in accordance with sensing an increased temperature associated with the at least one of the plurality of electronic devices; and

decreasing a flow rate of the coolant in accordance with sensing a decreased temperature associated with the at least one of the plurality of electronic devices.

12. The article of claim 8, wherein the information, when accessed, results in a machine performing:

adjusting a volume of the coolant to maintain a substantially constant coolant pressure.

13. The article of claim 8, wherein adjusting the flow rate of the coolant comprises adjusting the flow rate of the coolant to a substantially constant flow rate.

14. An apparatus, comprising:

a chassis heat exchange element including a plurality of receiving sections thermally coupled to a corresponding plurality of electronic devices;

a thermal conduit thermally coupled to the chassis heat exchange element; and

a flow rate regulator to adjust a flow rate of a coolant to be circulated in the thermal conduit.

15. The apparatus of claim 14, further including:

a pump to circulate the coolant in the thermal conduit.

16. The apparatus of claim 14, wherein the thermal conduit includes:

thermally conductive flow disruptive elements.

17. The apparatus of claim 14, wherein the coolant comprises one of water and an oil.

18. The apparatus of claim 14, further including:

a feedback and control system to monitor a temperature of at least one of the plurality of electronic devices.

19. The apparatus of claim 14, further including:

a heat sink including a heat exchanger thermally coupled to the chassis heat exchange element.

20. The apparatus of claim 14, wherein the flow rate regulator is capable of adjusting the flow rate of the coolant to be a substantially constant flow rate.

21. A system, comprising:

a chassis heat exchange element to be used down-hole and including a plurality of sections thermally coupled to a corresponding plurality of electronic devices;

a thermal conduit thermally coupled to the chassis heat exchange element;

a flow rate regulator to adjust a flow rate of a coolant to be circulated in the thermal conduit; and

a collar to couple to a drill bit and to house the chassis heat exchange element.

22. The system of claim 21, further including:

a fluid expansion compensator in fluid communication with the fluid conduit.

23. The system of claim 22, wherein the fluid expansion compensator includes a spring and a piston.

24. The system of claim 21, further including:

a circuit board having a thermally conductive layer thermally coupled to the plurality of electronic devices.

25. The system of claim 21, further including:

an antenna coupled to at least one of the plurality of electronic devices.

26. The system of claim 21, further including:

a heat sink including a heat exchanger thermally coupled to the chassis heat exchange element.

27. The system of claim 21, wherein the flow rate regulator is capable of adjusting the flow rate of the coolant to be a substantially constant flow rate.

28. A system, comprising:

a chassis heat exchange element to be used down-hole and including a plurality of receiving sections thermally coupled to a corresponding plurality of electronic devices;

a thermal conduit thermally coupled to the chassis heat exchange element;

a flow rate regulator to adjust a flow rate of a coolant to be circulated in the thermal conduit; and

a tool body to couple to a logging cable and to house the chassis heat exchange element.

29. The system of claim 28, further including:

a charging pump capable of being removably fluidly coupled to the thermal conduit.

30. The system of claim 28, wherein the logging cable includes one of a wireline, a mono-cable, and a slick-line.

31. The system of claim 28, further including:

a first circuit board attached to a first side of the chassis heat exchange element; and

a second circuit board attached to a second side of the chassis heat exchange element.

32. The system of claim 28, wherein the receiving sections are to receive the plurality of electronic devices attached to the first circuit board and to the second circuit board.

33. The system of claim 28, further including:

a heat sink including a heat exchanger thermally coupled to the chassis heat exchange element.

34. The system of claim 28, wherein the flow rate regulator is capable of adjusting the flow rate of the coolant to be a substantially constant flow rate.