Package with electronic circuitry

• US 20060144747A1
• Filed: 06/10/2004
• Published: 07/06/2006
• Est. Priority Date: 06/10/2003
• Status: Active Grant

• Current Assignee: Aardex Group
• Original Assignee: Meadwestvaco (WestRock Company)
• Inventors: Le, Thanhhung, Haraldsson, Rune
• Granted Patent: US 7,552,824 B2
• Time in Patent Office: Days
• US Class Current: 206/531
• CPC Class Codes: A61J 1/035 Blister-type containers blisters in general B65D75/36
• CPC Class Codes: A61J 7/0418 with electronic history memory
• CPC Class Codes: A61J 7/0481 working on a schedule basis

Abstract

Taught herein is a package with electronic circuitry for use in monitoring the removal of items from a receptacle, such as medication tablets from a blister cavity. The package is assembled with a plurality of cards, including a blister card (20), a backing card (30), and a trace card (40). The blister card includes at least one protruding receptacle (29) having an open side. The backing card includes at least one breachable closed cell (32), mated to a blister card such that the closed cell spans across the open side of the receptacle. And the trace card includes at least one breachable closed cell (32) and circuitry (42), mated to the backing card so that the closed cells are aligned. In another embodiment the backing card may be a layer of conductive foil (62) and the trace card may include a dielectric overlay (64).

Claims

1. A package with electronic circuitry, comprising:

a first card comprising at least one open cell;

a second card comprising at least one protruding receptacle having an open side, wherein said protruding receptacle is matingly nested within said open cell;

a third card comprising a first closed cell, mated to said second card such that said first closed cell spans across said open side; and

a fourth card comprising a second closed cell and circuitry, mated to said third card such that said second closed cell is breachably aligned with said first closed cell,

wherein said cards are non-conductive.

3. The package of claim 1, wherein at least a portion of said receptacle is pliable.

4. The package of claim 1, wherein a portion of said circuitry spans said second closed cell.

5. The package of claim 1, wherein said fourth card includes an electronic monitoring device receiving area in communication with said circuitry.

2. (canceled)

6. A package with electronic circuitry, comprising:

a first card comprising at least one protruding receptacle having an open side;

a second card comprising a first closed cell, mated to said first card such that said first closed cell spans across said open side; and

a third card comprising a second closed cell and circuitry, mated to said second card such that said second closed cell is breachably aligned with said first closed cell,

wherein said cards are non-conductive.

8. The package of claim 6, wherein at least a portion of said receptacle is pliable.

9. The package of claim 6, wherein a portion of said circuitry spans said second closed cell.

10. The package of claim 6, wherein said fourth card includes an electronic monitoring device receiving area in communication with said circuitry.

7. (canceled)

11. A package with electronic circuitry, comprising:

a first card comprising at least one protruding receptacle having an open side;

a conductive protective layer mated to said first card such that said protective layer spans across said open side; and

a second card comprising a closed cell, and circuitry with a dielectric overlay; and

,

wherein said second card is mated to said first card such that said dielectric overlay is adjacent to said protective layer and said closed cell is breachably aligned with said open side.

12. The package of claim 11, wherein said cards are non-conductive.

13. The package of claim 11, wherein at least a portion of said receptacle is pliable.

14. The package of claim 11, wherein said fourth card includes an electronic monitoring device receiving area in communication with said circuitry.

15. The package of claim 11, wherein said protective layer is conductive.

16. The package of claim 11, wherein a portion of said circuitry spans said closed cell.

17. The package of claim 11, wherein said overlay is applied on top of and covers at least a portion of said circuitry.

18. A method of monitoring the removal of an item from a receptacle, comprising:

providing a receptacle with an open side to receive and store an item;

inserting said item into said receptacle;

blocking said open side with a first card comprising a first breachable gate;

mating a second card, comprising a circuit than spans a second breachable gate, to said first card such that said first and second breachable gates are aligned,

forcing said item from an end opposite said open side, through said breachable gates to break said circuit,

recording the event of breaking said circuit, and

removing said item from said receptacle,

wherein said cards are non-conductive.