IC tag and IC tag attachment structure

• US 20060145872A1
• Filed: 12/15/2005
• Published: 07/06/2006
• Est. Priority Date: 12/16/2004
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Kim, Won Ho, Tanaka, Makoto, Matsugatani, Kazuoki, Kim, Moonil
• Granted Patent: US 7,416,135 B2
• Time in Patent Office: Days
• US Class Current: 340/572.800
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07771 the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A first metal plate for transmission and a second metal plate for transmission are closely-attached to a first surface and a second surface of a dielectric body, respectively. An outer edge of the first metal plate substantially symmetrically faces an outer edge of the second metal plate via the dielectric body. A metal plate for matching is arranged inside a hole formed on the second metal plate, with a slit formed with an inner wall of the hole, and is fixed to the dielectric body. The metal plate for matching is electrically connected to the first metal plate via a through hole penetrating the dielectric body. An IC chip is surface-mounted to connect the second metal plate with the metal plate for matching.

Claims

1. An IC tag, comprising:

a dielectric body having a shape of a plate;

a first transmission metal plate for transmission fixed to a first surface of the dielectric body;

a second transmission metal plate for transmission fixed to a second surface of the dielectric body for constituting an antenna together with the first transmission metal plate, wherein an outer edge of the second transmission metal plate is substantially symmetric with an outer edge of the first transmission metal plate via the dielectric body, wherein the second transmission metal plate includes a hole;

a matching metal plate for matching fixed to the dielectric body within the hole, forming a slit together with an inner surface of the hole, and being electrically connected with the first transmission metal plate via a through hole penetrating the dielectric body; and

an IC chip surface-mounted to connect the second transmission metal plate with the matching metal plate over the second surface of the dielectric body.

2. The IC tag according to claim 1, wherein:

the first transmission metal plate and the second transmission metal plate are formed of a same material and have a same thickness; and

the first transmission metal plate, the second transmission metal plate, and the matching metal plate are closely-attached to the dielectric body.

3. The IC tag according to claim 1, wherein

the matching metal plate is smaller than the second transmission metal plate.

4. The IC tag according to claim 1, wherein

the matching metal plate has a linear shape.

5. The IC tag according to claim 1, wherein

the matching metal plate has a bended shape.

6. The IC tag according to claim 1, wherein

the matching metal plate has a curved shape.

7. The IC tag according to claim 1, wherein

the second transmission metal plate has a rectangular planer shape with a diagonal corner of the second transmission metal plate cut off.

8. The IC tag according to claim 1, wherein

the IC tag is attached to one of a metal and a dielectric material, with the first transmission metal plate closely-attached to the one of the metal and the dielectric material.

9. The IC tag according to claim 1, wherein

the IC tag is attached to one of a metal and a dielectric material, with the one of the metal and the dielectric material facing the second transmission metal plate with an interval.

10. An IC tag attachment structure, comprising:

the IC tag according to claim 1;

and

one of a metal and a dielectric material to which the IC tag is attached, wherein

the first transmission metal plate of the IC tag is closely-attached to the one of the metal and the dielectric material.

11. An IC tag attachment structure, comprising:

the IC tag according to claim 1;

and

one of a metal and a dielectric material to which the IC tag is attached, wherein

the one of the metal and the dielectric material faces the second transmission metal plate with an interval.

12. An IC tag, comprising:

a dielectric body having a shape of a plate;

a first transmission metal plate for transmission fixed to a first surface of the dielectric body;

a second transmission metal plate for transmission fixed to a second surface of the dielectric body for constituting an antenna together with the first transmission metal plate, wherein both outer edges of the first transmission metal plate and the second transmission metal plate face each other via the dielectric body with a misalignment of λ

/30 or less in a direction parallel with the first and second surfaces of the dielectric body, wherein the value λ

is wavelength of an electric wave in the dielectric body, wherein the second transmission metal plate includes a hole;

a matching metal plate for matching fixed to the dielectric body within the hole, forming a slit together with an inner surface of the hole, and being electrically connected with the first transmission metal plate via a through hole penetrating the dielectric body; and

an IC chip surface-mounted to connect the second transmission metal plate with the matching metal plate over the second surface of the dielectric body.

13. The IC tag according to claim 12, wherein:

the first transmission metal plate and the second transmission metal plate are formed of a same material and have a same thickness; and

the first transmission metal plate, the second transmission metal plate, and the matching metal plate are closely-attached to the dielectric body.

14. The IC tag according to claim 12, wherein

the matching metal plate is smaller than the second transmission metal plate.

15. The IC tag according to claim 12, wherein

the matching metal plate has a linear shape.

16. The IC tag according to claim 12, wherein

the matching metal plate has a bended shape.

17. The IC tag according to claim 12, wherein

the matching metal plate has a curved shape.

18. The IC tag according to claim 12, wherein

the second transmission metal plate has a rectangular planer shape with a diagonal corner of the second transmission metal plate cut off.

19. The IC tag according to claim 12, wherein

the IC tag is attached to one of a metal and a dielectric material, with the first transmission metal plate closely-attached to the one of the metal and the dielectric material.

20. The IC tag according to claim 12, wherein

the IC tag is attached to one of a metal and a dielectric material, with the one of the metal and the dielectric material facing the second transmission metal plate with an interval.

21. An IC tag attachment structure, comprising:

the IC tag according to claim 12;

and

one of a metal and a dielectric material to which the IC tag is attached, wherein

the first transmission metal plate of the IC tag is closely-attached to the one of the metal and the dielectric material.

22. An IC tag attachment structure, comprising:

the IC tag according to claim 12;

and

one of a metal and a dielectric material to which the IC tag is attached, wherein

the one of the metal and the dielectric material faces the second transmission metal plate with an interval.