High frequency signal transmission line having reduced noise

• US 20060146484A1
• Filed: 09/07/2005
• Published: 07/06/2006
• Est. Priority Date: 12/30/2004
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Chae, Woo Lim, Ryu, Chang Myung, Kim, Young Woo, Kim, Han
• Granted Patent: US 7,543,264 B2
• Time in Patent Office: Days
• US Class Current: 361/600
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 2201/09618 Via fence, i.e. one-dimensional array of vias

Abstract

A high frequency signal transmission line having reduced noise. Particularly, a signal transmission line of the current invention has reduced radiation noise and reflection noise, because a conventional ground guard fence line disposed between signal lines is separated into a plurality of ground line blocks that are spaced apart from each other to shield against noise.

Claims

1. A printed circuit board for high frequency signal transmission, comprising:

a plurality of transmission lines patterned on a printed circuit board to transmit a high frequency signal;

a plurality of ground line blocks disposed between the transmission lines and spaced apart from each other by a predetermined interval in a signal transmission direction to reduce noise, wherein each ground line block has a via hole; and

ground electrodes connected to the ground line block by the via hole.

2. The printed circuit board as set forth in claim 1, wherein the ground electrodes are formed on different layers than the plurality of transmission lines and the plurality of ground line blocks.

3. The printed circuit board as set forth in claim 1, wherein an insulating layer is disposed among the ground electrodes, the transmission lines, and the ground line blocks.

4. The printed circuit board as set forth in claim 1, wherein the ground line blocks are spaced apart from each other by an interval (SSGFL) represented by

S_SGFL=c/37·

F_max

wherein c is 2.998×

10¹¹ mm/sec that is a light speed;

F_max is an operation frequency of a transmitted signal; and

37 is a relative dielectric constant of the insulating layer.

5. The printed circuit board as set forth in claim 4, wherein F_max is five times the operation frequency of the transmitted signal when the transmitted signal is a digital signal.

6. The printed circuit board as set forth in claim 4, wherein F_max is the operation frequency of the transmitted signal when the transmitted signal is a RF signal.