Cooling apparatus, system, and associated method
First Claim
Patent Images
1. A cooling apparatus comprising:
- at least one printed circuit board having opposed major surfaces;
at least one heat source positioned on one major surface of the printed circuit board; and
a pulsating heat pipe having at least a portion that is positioned to either extend along and proximate to one of the major surfaces or be embedded within the printed circuit board such that the pulsating heat pipe is capable of transferring heat from the printed circuit board.
1 Assignment
0 Petitions
Accused Products
Abstract
A cooling apparatus, system, and method are provided. The cooling apparatus includes at least one printed circuit board having opposed major surfaces, and at least one electrical component or other heat source positioned on one major surface of the printed circuit board. The cooling apparatus also includes a pulsating heat pipe having at least a portion that is positioned to either extend along and proximate to one of the major surfaces or be embedded within the printed circuit board. As such, the pulsating heat pipe is capable of transferring heat from the printed circuit board.
-
Citations
26 Claims
-
1. A cooling apparatus comprising:
-
at least one printed circuit board having opposed major surfaces;
at least one heat source positioned on one major surface of the printed circuit board; and
a pulsating heat pipe having at least a portion that is positioned to either extend along and proximate to one of the major surfaces or be embedded within the printed circuit board such that the pulsating heat pipe is capable of transferring heat from the printed circuit board. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A cooling system comprising:
-
a chassis housing;
at least one printed circuit board having opposed major surfaces and positioned within the chassis housing;
at least one heat source positioned on one major surface of the printed circuit board; and
a pulsating heat pipe having at least a portion that is positioned to either extend along and proximate to one of the major surfaces or be embedded within the printed circuit board such that the pulsating heat pipe is capable of transferring heat from the printed circuit board and out of the chassis housing. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. A method for cooling at least one printed circuit board, the method comprising:
-
providing a cooling system comprising;
a chassis housing;
at least one printed circuit board having opposed major surfaces and positioned within the chassis housing;
at least one heat source positioned on one major surface of the printed circuit board; and
a pulsating heat pipe having at least a portion that is positioned to either extend along and proximate to one of the major surfaces or be embedded within the printed circuit board;
transferring heat from the printed circuit board with the pulsating heat pipe; and
transferring heat away from the printed circuit board and out of the chassis housing by movement of the heat through the pulsating heat pipe. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26)
-
Specification