Method and structure for forming an integrated spatial light modulator
First Claim
1. A method of fabricating an integrated spatial light modulator, the method comprising:
- providing a first substrate including a bonding surface;
processing a device substrate to form at least an electrode layer, the electrode layer including a plurality of electrodes;
depositing a standoff layer on the electrode layer;
forming standoff structures from the standoff layer; and
joining the bonding surface of the first substrate to the standoff structures on the device substrate.
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Abstract
A method of fabricating an integrated spatial light modulator. The method includes providing a first substrate including a bonding surface, processing a device substrate to form at least an electrode layer, the electrode layer including a plurality of electrodes, and depositing a standoff layer on the electrode layer. The method further includes forming standoff structures from the standoff layer and joining the bonding surface of the first substrate to the standoff structures on the device substrate. In a particular embodiment, the method further includes, after the step of depositing a standoff layer, performing chemical mechanical polishing of the standoff layer to planarize an upper surface of the standoff layer.
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Citations
20 Claims
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1. A method of fabricating an integrated spatial light modulator, the method comprising:
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providing a first substrate including a bonding surface;
processing a device substrate to form at least an electrode layer, the electrode layer including a plurality of electrodes;
depositing a standoff layer on the electrode layer;
forming standoff structures from the standoff layer; and
joining the bonding surface of the first substrate to the standoff structures on the device substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of fabricating an integrated spatial light modulator, the method comprising:
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providing a first substrate including a bonding surface;
providing a second substrate including a plurality of electrodes;
depositing a standoff layer on the second substrate;
forming standoff structures from the standoff layer;
joining the bonding surface of the first substrate to the standoff structures on the second substrate;
thinning the first substrate;
patterning the first substrate to form a mask; and
forming a plurality of moveable structures from the first substrate, at least one of the moveable structures aligned with at least one of the plurality of electrodes. - View Dependent Claims (16, 17)
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18. An array of integrated spatial light modulators comprising:
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an electrode layer coupled to a device substrate, the electrode layer including a plurality of electrodes and at least one alignment mark;
a three-dimensional standoff structure, the standoff structures having side regions, bottom regions coupled to the device substrate, and top regions opposite the bottom regions; and
a semi-transparent silicon layer coupled to the top regions of the standoff structure, the semi-transparent silicon layer comprising;
a hinge support region coupled to the top regions of the standoff structure;
a plurality of hinges coupled to the hinge support regions; and
a plurality of moveable members aligned with respect to the at least one alignment mark by imaging the at least one alignment mark through the semi-transparent silicon layer. - View Dependent Claims (19, 20)
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Specification