Optical interference display panel

• US 20060148365A1
• Filed: 03/07/2006
• Published: 07/06/2006
• Est. Priority Date: 08/15/2003
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm, Inc.
• Inventors: Tsai, Hsiung-Kuang
• Granted Patent: US 7,470,373 B2
• Time in Patent Office: Days
• US Class Current: 445/24
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

An optical interference display panel is disclosed that has a substrate, an optical interference reflection structure, and an opaque protection structure. The optical interference reflection structure has many color-changeable pixels and is formed on the substrate. The opaque protection structure is adhered and fixed onto the substrate with an adhesive and encloses the optical interference reflection structure between the substrate and the opaque protection structure. The opaque protection structure blocks and/or absorbs light, and light is thus not emitted outward by passing through defects in the optical interference reflection structure. Moreover, the opaque protection structure and the adhesive also prevent the optical interference reflection structure from being damaged by an external environment.

Claims

1. A method for manufacturing an optical interference display panel, the method comprising:

providing a first substrate;

forming an optical interference reflection structure on the first substrate; and

adhering an opaque protection structure to the first substrate to position the optical interference reflection structure between the opaque protection structure and the first substrate;

wherein the opaque protection structure prevents light from passing through a defect in the optical interference reflection structure and causing a bad pixel.

2. The method of claim 1, wherein the optical interference reflection structure comprises:

forming a first electrode on the first substrate;

forming a sacrificial layer on the first electrode;

forming a plurality of first openings in the first electrode and the sacrificial layer;

forming a support in each of the first opening;

forming a second electrode on the sacrificial layer and the supports; and

removing the sacrificial layer by a release etch process.

3. The method of claim 1, wherein the opaque protection structure is a flat protection structure or a U-shaped protection structure.

4. The method of claim 1, wherein a material of the opaque protection structure is an opaque material or a light absorptive material.

5. The method of claim 1, wherein the opaque protection structure comprises:

a second substrate; and

an opaque film, deposited on the second substrate.

6. The method of claim 1, wherein the opaque film is between the second substrate and the optical interference reflection structure.

7. The method of claim 1, wherein the opaque film is a metal film or a light absorptive film.

8. The method of claim 1, wherein the first substrate and the opaque protection structure are airtight to prevent the optical interference reflection structure from being damaged by an external environment.

9. The method of claim 1, wherein the adhering step comprises adhering the opaque protection structure to the first substrate with an adhesive.

10. The method of claim 9, wherein the adhesive comprises spacers, and the spacers keep a predetermined distance between the opaque protection structure and the first substrate to prevent the opaque protection structure from damaging the optical interference reflection structure.

11. The method of claim 9, wherein the adhesive comprises a UV glue or a thermosetting adhesive.