Brush for cleaning wafer
First Claim
Patent Images
1. A method, comprising:
- forming a polymer solution with a plurality of nano-scale porogens;
coating a plurality of extremity portions of a plurality of nodules of a cleaning brush with the polymer solution; and
curing the polymer solution.
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Abstract
In a formulation of a wafer cleaning brush, forming a polymer solution with a plurality of nano-scale porogens or with a synthetic pore forming agent and curing the polymer solution to form a porous polymeric material.
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Citations
30 Claims
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1. A method, comprising:
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forming a polymer solution with a plurality of nano-scale porogens;
coating a plurality of extremity portions of a plurality of nodules of a cleaning brush with the polymer solution; and
curing the polymer solution. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A wafer cleaning brush, comprising:
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a core;
a plurality of spaced-apart nodules disposed to protrude from the core;
each of the nodules having a first portion proximately located relative to the core and a second portion distally located relative to the core;
a selected one of the first and the second portions including a plurality of micro-size pores; and
the other one of the first and the second portions including a plurality of nano-size pores. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A method of forming a cleaning pad, comprising:
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mixing a synthetic polymer with a synthetic pore forming agent and an aldehyde to form a mixture, the synthetic pore forming agent being selected from a group of bovine serum albumin, polyethyleneglycol, polyvinyl pyrrolidone and ethyl acetate; and
curing the mixture to form a porous polymeric material. - View Dependent Claims (15, 16, 17)
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18. A method of forming a cleaning pad, comprising:
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mixing a polymer solution with a phosphoric acid and a zinc chloride to form a mixture; and
removing the zinc chloride from the mixture to form a porous polymeric material. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25)
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26. A method for cleaning a semiconductor wafer, comprising:
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providing a scrubber having a wafer mounted therein and including at least one cleaning brush rotatably mounted adjacent to the wafer;
the cleaning brush including;
a core;
a plurality of spaced-apart nodules disposed to protrude from the core;
each of the nodules having a first portion proximately located relative to the core and a second portion distally located relative to the core;
the first portion including a plurality of micro-size pores;
the second portion including a plurality of nano-size pores; and
scrubbing the wafer by rotatably engaging the wafer with the at least one cleaning brush. - View Dependent Claims (27, 28, 29, 30)
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Specification