Plasma processing system and baffle assembly for use in plasma processing system

• US 20060151114A1
• Filed: 01/11/2005
• Published: 07/13/2006
• Est. Priority Date: 01/11/2005
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Fink, Steven T.
• Granted Patent: US 7,601,242 B2
• Time in Patent Office: Days
• US Class Current: 156/345.290
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32633 Baffles
• CPC Class Codes: H01L 21/67069 for drying etching

Abstract

The present invention presents a baffle assembly located in a plasma processing system, comprising a baffle carrier attached to the plasma processing system, and at least two baffle inserts having a plurality of passages therethrough, the at least two baffle inserts being supported by the baffle carrier.

Claims

1. A baffle assembly located in a plasma processing system having a chuck assembly for holding a substrate, comprising:

a baffle carrier attached to the plasma processing system; and

at least two baffle inserts having a plurality of passages therethrough, the at least two baffle inserts being supported by the baffle carrier.

2. The baffle assembly as recited in claim 1, wherein the at least two baffle inserts are not secured to any part of the plasma processing system.

3. The baffle assembly as recited in claim 1, wherein the at least two baffle inserts have the same shape.

4. The baffle assembly as recited in claim 1, wherein each of the at least two baffle inserts are adjacent to each other.

5. The baffle assembly as recited in claim 1, wherein the at least two baffle inserts have a disk shape.

6. The baffle assembly as recited in claim 1, wherein the plasma processing system includes a passageway for gas, and the at least two baffle inserts cover substantially the entire passageway.

7. The baffle assembly as recited in claim 1, wherein the baffle carrier comprises a baffle carrier ring attached to the chuck assembly and baffle carrier supports secured to the baffle carrier ring, and edges of the at least two baffle inserts are supported by the baffle carrier supports.

8. The baffle assembly as recited in claim 1, wherein the baffle carrier comprises a baffle carrier ring attached to the plasma processing system and having a slot, and each of the at least two baffle inserts further comprises a tab inserted into the slot.

9. The baffle assembly as recited in claim 1, wherein the baffle carrier comprises a first baffle carrier ring attached to the plasma processing system, support rods having first ends secured to the baffle carrier ring, and a second baffle carrier ring secured to the second ends of said support rods, the at least two baffle inserts resting on at least the baffle carrier ring and the second baffle carrier ring.

10. The baffle assembly as recited in claim 1, wherein the baffle inserts are substantially horizontal.

11. The baffle assembly as recited in claim 1, wherein the baffle inserts are inclined relative to horizontal.

12. A plasma processing system comprising:

a processing chamber;

a chuck assembly disposed in said chamber for holding a substrate; and

a baffle assembly located in the processing chamber, wherein said baffle assembly comprises a baffle carrier attached to the plasma processing system, and at least two baffle inserts having a plurality of passages therethrough, the at least two baffle inserts being supported by the baffle carrier.

13. The plasma processing system as recited in claim 12, wherein the at least two baffle inserts are not secured to any part of the plasma processing system.

14. The plasma processing system as recited in claim 12, wherein the at least two baffle inserts have the same shape.

15. The plasma processing system as recited in claim 12, wherein each of the at least two baffle inserts are adjacent to each other.

16. The plasma processing system as recited in claim 12, wherein the at least two baffle inserts have a disk shape.

17. The plasma processing system as recited in claim 12, wherein the plasma processing system includes a passageway for gas, and the at least two baffle inserts cover substantially the entire passageway.

18. The plasma processing system as recited in claim 12, wherein the baffle carrier comprises a baffle carrier ring attached to the chuck assembly and baffle carrier supports secured to the baffle carrier ring, and edges of the at least two baffle inserts are supported by the baffle carrier supports.

19. The plasma processing system as recited in claim 12, wherein the baffle carrier comprises a baffle carrier ring attached to the plasma processing system and having a slot, and the each of at least two baffle inserts further comprises a tab inserted into the slot.

20. The plasma processing system as recited in claim 12, wherein the baffle carrier comprises a first baffle carrier ring attached to the plasma processing system, support rods having first ends secured to the baffle carrier ring, and a second baffle carrier ring secured to the second ends of said support rods, the at least two baffle inserts resting on at least the baffle carrier ring and the second baffle carrier ring.

21. The plasma processing system as recited in claim 12, wherein the baffle inserts are substantially horizontal.

22. The plasma processing system as recited in claim 12, wherein the baffle inserts are inclined relative to horizontal.

23. The plasma processing system as recited in claim 12, wherein the baffle carrier is coupled to the chuck assembly.

24. A method of maintaining a plasma processing system having a chuck assembly for holding a substrate, said method comprising:

deactivating said plasma processing system having a baffle assembly therein, the baffle assembly comprises a baffle carrier attached to said plasma processing system, and at least two baffle inserts having a plurality of passages therethrough and being supported by the baffle carrier;

removing said at least two baffle inserts from the plasma processing system without removing the baffle carrier;

cleaning the at least two baffle inserts; and

replacing the cleaned at least two baffle inserts on the baffle carrier.

25. A method of maintaining a plasma processing system as recited in claim 24, wherein the at least two baffle inserts are not secured to any part of the plasma processing system.

26. A method of maintaining a plasma processing system having a chuck assembly for holding a substrate, said method comprising:

deactivating a plasma processing system having a baffle assembly therein, the baffle assembly comprises a baffle carrier attached to said plasma processing system, and at least two baffle inserts having a plurality of passages therethrough and being supported by the baffle carrier;

removing said at least two baffle inserts from the plasma processing system without removing the baffle carrier; and

placing at least two other baffle inserts onto the baffle carrier instead of replacing the removed at least two baffle inserts.

27. A method of maintenance of a plasma processing system as recited in claim 26, wherein the at least two baffle inserts are not secured to any part of the plasma processing system.