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Sputtering system and manufacturing method of thin film

  • US 20060151314A1
  • Filed: 03/13/2006
  • Published: 07/13/2006
  • Est. Priority Date: 10/25/2002
  • Status: Abandoned Application
First Claim
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1. A method for manufacturing a semiconductor device comprising the steps of:

  • coating a surface of a part of a sputtering chamber by spraying a material including a semiconductor material;

    forming a first insulating film on a substrate by sputtering in the sputtering chamber;

    forming a semiconductor layer over the first insulating film;

    forming a gate insulating film over the semiconductor layer;

    forming a gate electrode over the gate insulating film; and

    forming a second insulating film over the gate electrode.

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