Surface mountable light emitting device
First Claim
1. A high power surface mountable light emitting device comprising:
- a light emitting semiconductor chip;
a thermally and electrically conductive lead frame connected to said chip and exposed over a substantial portion of the underside of the device;
a lead wire from said chip to a contact exposed at least partially on a side of said device; and
a lens over said chip wherein the lens comprises;
a lower transfer section; and
an upper ejector section situated upon the lower transfer section, said lower transfer section operable for placement upon the light emitting semiconductor chip and operable to transfer the radiant emission to said upper ejector section, said upper ejector section shaped such that the emission is redistributed externally into a substantial solid angle.
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Accused Products
Abstract
This invention relates to a surface mountable light emitting device in which the lead frame is exposed over a substantial portion of the underside of the device so as to allow greater thermal conductivity to any device on which it may be mounted. The LED provides the lens and a molded body to encapsulate the lead frame and an electrical contact in a single molding step while the lead frames and further contacts are arranged in a suitable array. The lens couples the luminous output of a light-emitting diode (LED) to a predominantly spherical pattern comprises a transfer section that receives the LED'"'"'s light within it and an ejector atop it that receives light from the transfer section and spreads it spherically. Applications may include, but are not limited to, household light bulbs and car headlights.
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Citations
22 Claims
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1. A high power surface mountable light emitting device comprising:
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a light emitting semiconductor chip;
a thermally and electrically conductive lead frame connected to said chip and exposed over a substantial portion of the underside of the device;
a lead wire from said chip to a contact exposed at least partially on a side of said device; and
a lens over said chip wherein the lens comprises;
a lower transfer section; and
an upper ejector section situated upon the lower transfer section, said lower transfer section operable for placement upon the light emitting semiconductor chip and operable to transfer the radiant emission to said upper ejector section, said upper ejector section shaped such that the emission is redistributed externally into a substantial solid angle. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification