Package for gallium nitride semiconductor devices

• US 20060151868A1
• Filed: 01/10/2005
• Published: 07/13/2006
• Est. Priority Date: 01/10/2005
• Status: Abandoned Application

• Current Assignee: Velox Semiconductor Corporation (Power Integrations Incorporated)
• Original Assignee: Velox Semiconductor Corporation (Power Integrations Incorporated)
• Inventors: Peres, Boris, Shelton, Bryan S., Zhu, TingGang, Pabisz, Marek K., Liu, Linlin, Gottfried, Mark, Ceruzzi, Alex D.
• Application Number:
  US11/032,666
• Publication Number:
  US 20060151868A1
• Time in Patent Office: Days
• US Class Current: 257/690
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/43 Manufacturing methods
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10272 : Silicon Carbide [SiC]
• CPC Class Codes: H01L 2924/12032 : Schottky diode
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/2076 : equal to or larger than 100 microns
• CPC Class Codes: H01L 2924/3011 : Impedance

Abstract

A packaged semiconductor device, in particular a gallium nitride semiconductor structure including a lower semiconductor layer and an upper semiconductor layer disposed over a portion of the lower semiconductor layer. The semiconductor structure includes a plurality of mesas projecting upwardly from the lower layer, each of the mesas including a portion of the upper layer and defining an upper contact surface separated form adjacent mesas by a portion of the lower layer surface. The device further includes a die mounting support, wherein the bottom surface of the die is attached to the top surface of the die mounting support; and a plurality of spaced external conductors extending from the support, at least once of said spaced external conductors having a bond wire post at one end thereof; with a bonding wire extending between the bond wire post and a contact region to the top surface of the plurality of mesas.

Claims

1. A semiconductor device comprising:

a semiconductor die having a top surface including a lower semiconductor layer and an upper semiconductor layer disposed over a portion of said lower semiconductor layer, said lower semiconductor layer and said upper semiconductor layer being of the same conductivity type, said lower semiconductor layer being more highly doped than said upper semiconductor layer, said semiconductor die including a plurality of mesas projecting upwardly from said lower contact surface, each of said plurality of mesas including a portion of said upper layer and defining an upper contact surface separated from adjacent ones of said plurality of mesas by a portion of said lower contact surface; and

a bottom surface opposite to said top surface;

a die mounting support, wherein the bottom surface of said die is attached to the top surface of said die mounting support;

a housing enclosing said semiconductor die and die mounting support;

a plurality of spaced external conductors extending from said housing, at least one of said spaced external conductors having a bond wire post at one end thereof; and

a first bonding wire extending between one of said bond wire posts and a first contact region common to said plurality of mesas.

2. A device as defined in claim 1, wherein said upper and lower semiconductor layers are composed of gallium nitride.

3. A device as defined in claim 1, further comprising a second bonding wire extending between said one bond wire post and a second contact region on the upper contact surface of the semiconductor die and common to said plurality of mesas.

4. A device as defined in claim 3, wherein said first and second bonding wires have a five mil thickness.

5. A device as defined in claim 3, wherein said contact regions are substantially square regions with a side dimension of about 375 microns.

6. A device as defined in claim 1, further comprising a second bonding wire extending between another one of said wire posts and a first contact region on the lower contact surface of the semiconductor die.

7. A device as defined in claim 1, wherein said semiconductor die is a diode capable of operating at a forward voltage of eight amperes.

8. A device as defined in claim 6, further comprising a third bonding wire extending between said another one of said bond wire posts and a second contact region on the lower contact surface of the semiconductor die.

9. A device as defined in claim 1, wherein said device is a Schottky diode.

10. A device as defined in claim 1, wherein said mesas form a sequence of elongated parallel fingers extending in opposite directions away from a central region in the middle of the semiconductor die.

11. A semiconductor device comprising:

a semiconductor die having a top surface including a lower semiconductor layer and an upper semiconductor layer disposed over a portion of said lower semiconductor layer, said lower semiconductor layer and said upper semiconductor layer being of the same conductivity type, said lower semiconductor layer being more highly doped than said upper semiconductor layer;

a first metal layer disposed over the upper layer and forming a Schottky junction on each of a plurality of mesas projecting upwardly from said lower contact surface, each of said plurality of mesas including a portion of said upper layer and defining an upper contact surface separated from adjacent ones of said plurality of mesas by a portion of said lower contact surface, a second metal layer disposed over said first metal layer and making electrical contact with each of the Schottky devices on said mesas and forms a first electrode bonding surface;

a third metal layer disposed over portions of said lower semiconductor layer and making ohmic contact therewith; and

a fourth metal layer disposed over said third metal layer and forming a second electrode bonding surface.

12. A device as defined in claim 11, further comprising

a die mounting support having first and second bonding electrodes, wherein the top surface of said die is attached to the top surface of said die mounting support so that the first and second electrode bonding surfaces of the die make electrical connection to the first and second bonding electrodes respectively.

13. A device as defined in claim 12, wherein said die is directly attached to the die mounting support by solder or thermally conductive epoxy.

14. A device as defined in claim 11, wherein said second and said fourth metal layers are solderable metal layers.

15. A device as defined in claim 11, wherein said second and said fourth metal layers form substantially rectangular discrete bonding areas on the top surface of the die, each area separated from the other area by a region of dielectric material.