Miniature circuitry and inductive components and methods for manufacturing same
First Claim
1. A miniature transformer comprising:
- a support member having a toroidal-shaped cavity formed therein, a ferrite toroid embedded in said cavity such that said toroid is substantially contained within said cavity, a first and second printed circuit formed on respectively opposite sides of said support member, a first plurality of plated through holes in said support member around the outside perimeter of said cavity of said toroidal cavity, a second plurality of plated through holes in said support member around the inside perimeter of said cavity, said first printed circuit including connecting respective first and second plated through holes, said second printed circuit including connecting respective first and second plated through holes, a third plurality of plated through holes in the same holes as said first plurality of plated through holes, said first and third plurality of through holes being electrically insulated from each other by vacuum depositing a thin layer of parylene followed by treating the outside surface of the parylene coated holes with an adhesion promoter. a fourth plurality of plated through holes in the same holes as said second plurality of plated through holes, said second and fourth plated through holes being electrically insulated from each other by the vacuum deposited thin layer at parylene, third and fourth printed circuits formed in respective layers over the layers of said first and second printed circuits with an insulated layer therebetween, said third printed circuit including connecting respective third and fourth plated through holes, said fourth printed circuit including connecting respective third and fourth through holes, said plated through holes and printed circuit connections forming primary and secondary windings of said miniature transformer.
2 Assignments
0 Petitions
Accused Products
Abstract
Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.
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Citations
32 Claims
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1. A miniature transformer comprising:
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a support member having a toroidal-shaped cavity formed therein, a ferrite toroid embedded in said cavity such that said toroid is substantially contained within said cavity, a first and second printed circuit formed on respectively opposite sides of said support member, a first plurality of plated through holes in said support member around the outside perimeter of said cavity of said toroidal cavity, a second plurality of plated through holes in said support member around the inside perimeter of said cavity, said first printed circuit including connecting respective first and second plated through holes, said second printed circuit including connecting respective first and second plated through holes, a third plurality of plated through holes in the same holes as said first plurality of plated through holes, said first and third plurality of through holes being electrically insulated from each other by vacuum depositing a thin layer of parylene followed by treating the outside surface of the parylene coated holes with an adhesion promoter. a fourth plurality of plated through holes in the same holes as said second plurality of plated through holes, said second and fourth plated through holes being electrically insulated from each other by the vacuum deposited thin layer at parylene, third and fourth printed circuits formed in respective layers over the layers of said first and second printed circuits with an insulated layer therebetween, said third printed circuit including connecting respective third and fourth plated through holes, said fourth printed circuit including connecting respective third and fourth through holes, said plated through holes and printed circuit connections forming primary and secondary windings of said miniature transformer.
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2. A miniature transformer comprising:
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a support member having a toroid shaped cavity formed therein;
a ferrite toroid embedded in said cavity such that said toroid is substantially contained within said cavity, first and second printed circuits formed on respectively opposite sides of said support members, a first plurality of plated through holes in said support member around the outside perimeter of said cavity of toroid cavity, a second plurality of plated through holes in said support member around the inside perimeter of said cavity, said first printed circuit including connecting respective first and second plated through holes, said second printed circuit including connecting respective first and second plated through holes, a third plurality of plated through holes in the same holes as said first plurality of plated through holes, said first and third plurality of through holes being electrically insulated from each other by a thin vacuum deposited layer of parylene, a fourth plurality of plated through holes in the same holes as said second plurality of plated through holes, said second and fourth plated through holes being electrically insulated from each other by a thin vacuum deposited layer of parylene, third and fourth printed circuits formed in respective layers over the layers of said first and second printed circuit with an insulated layer therebetween, said third printed circuit including connecting respective third and fourth plated through holes, said fourth printed circuit including connecting respective third and fourth through holes, said plated through holes and printed circuit connections forming primary and secondary windings of said miniature transfomers.
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3. A miniature transformer comprising:
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a support member having a toroid shaped cavity found therein, a ferrite toroid embedded in said cavity such that said toroid is substantially contained within said cavity, first and second printed circuits formed on respectively opposite sides of said support member, a first plurality of plated through holes in said support member around the outside perimeter of said cavity of toroidal cavity, a second plurality of plated through holes in said support member around the inside perimeter of said cavity, said first printed circuit including connecting respective first and second plated through holes, said second printed circuit including connecting respective first and second plated through holes, a third plurality of plated through holes in the same holes as said first plurality of plated through holes, said first and third plurality of through holes being electrically insulated from each other by having a substantially pin-hole free insulating layer having a thickness in the range of about 0.5 mil to 3 mil and having a voltage breakdown guard band in the range of about 5600 to 15,000 volts per mil per unit of thickness, a fourth plurality of plated through holes in the same holes as said second plurality of plated through holes, said second and fourth plated through holes being electrically insulated from each other by substantially said pin-hole free insulating layer, third and fourth printed circuit formed in respective layers over the layers of said first and second printed circuits with an insulated layer therebetween, said third printed circuit including connecting respective third and fourth plated through holes, said fourth printed circuit including connecting respective third and fourth through holes, said plated through holes and printed circuit connections forming primary and secondary windings of said miniature transformers.
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4. A miniature transformer having a base member,
a cavity formed in said base, an inductive member located in said cavity, said member providing a magnetic core of said transformer, a plurality of openings in said base, a plurality of plated through hole conductors formed in said through hole openings, each of said conductors being respectively electrically insulated from another plated through hole conductor in the same hole by a thin vacuum deposited polymer film, said plated through hole conductor providing respective electrical primary and secondary transformer windings of said transformer.
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16. A multiple layered printed circuit comprising
first and second printed circuits on opposite sides of an insulating support member, insulation layers respectively covering said first and second printed circuits, third and fourth printed circuits over said insulated first and second layers, at least one opening through said support member, at least two plated through conductors in at least one opening, said conductors insulated from each other by a thin vacuum deposited film, and one of said plated through conductors electrically connected to printed circuits on opposite sides of said support member and another of said plated through hole.
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20. A circuit composing
a plurality of plated through holes in a support member, and a thin vacuum deposited insulating member between each of said plated through holes.
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24. A method for making plural plated through holes in a single circuit board via comprising
plating copper in the walls of said circuit board via to form a first plated through hole, applying a thin layer of first adhesive promotor to the surface of said plated via, vacuum deposit an organic layer having a high dielectric strength unto said layer of first adhesive promoter, applying a second layer of adhesive promoter over said layer of polymer, and plating copper over said second layer of adhesive promoter to form a second plated through hole in said circuit board via.
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32. A method for making plural insulated conductor through holes in a single circuit board via comprising:
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applying a first conductive layer on the walls of said circuit board via to form a first conductor through hole, applying a layer of first adhesive promoter to the surface said first conductor layer, depositing a thin organic layer having a high dielectric strength onto said layer of first adhesive promoter. applying a second layer of adhesive promoter on said organic layer, and applying a second conductor layer over said second layer of adhesive promoter.
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Specification