Electrical contact method and structure for deflection devices formed in an array configuration
First Claim
1. A method of fabricating an electrical connection for a spatial light modulator, the method comprising:
- providing a first substrate, the first substrate comprising;
a plurality of bias electrodes coupled to the first substrate, the plurality of bias electrodes having an upper surface and a lower surface and arranged in a spatial manner as a first array; and
a plurality of dielectric bond pads coupled to the plurality of bias electrodes;
providing a second substrate of a predetermined thickness, the second substrate including a plurality of recessed regions within the predetermined thickness and arranged in a spatial manner as a second array, each of the recessed regions being bordered by a standoff region, the standoff region having a thickness defined by a portion of the predetermined thickness;
joining the dielectric bond pads of the first substrate to the standoff region of the second substrate;
forming mirror structures from a first portion of the second substrate;
exposing a portion of the upper surface of the plurality of bias electrodes; and
depositing a conductive layer on the mirror structures and the exposed portion of the upper surface of the plurality of bias electrodes to provide an electrical connection between the plurality of bias electrodes and the mirror structures.
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Accused Products
Abstract
A method of fabricating an electrical connection for a spatial light modulator includes providing a first substrate including a plurality of bias electrodes and a plurality of dielectric bond pads. The method also includes providing a second substrate of a predetermined thickness, the second substrate including a plurality of recessed regions within the predetermined thickness and arranged in a spatial manner as a second array, each of the recessed regions being bordered by a standoff region, and joining the dielectric bond pads of the first substrate to the standoff region of the second substrate. The method further includes forming mirror structures from a first portion of the second substrate, exposing a portion of the upper surface of the plurality of bias electrodes, and depositing a conductive layer on the mirror structures and the exposed portion of the upper surface of the plurality of bias electrodes.
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Citations
20 Claims
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1. A method of fabricating an electrical connection for a spatial light modulator, the method comprising:
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providing a first substrate, the first substrate comprising;
a plurality of bias electrodes coupled to the first substrate, the plurality of bias electrodes having an upper surface and a lower surface and arranged in a spatial manner as a first array; and
a plurality of dielectric bond pads coupled to the plurality of bias electrodes;
providing a second substrate of a predetermined thickness, the second substrate including a plurality of recessed regions within the predetermined thickness and arranged in a spatial manner as a second array, each of the recessed regions being bordered by a standoff region, the standoff region having a thickness defined by a portion of the predetermined thickness;
joining the dielectric bond pads of the first substrate to the standoff region of the second substrate;
forming mirror structures from a first portion of the second substrate;
exposing a portion of the upper surface of the plurality of bias electrodes; and
depositing a conductive layer on the mirror structures and the exposed portion of the upper surface of the plurality of bias electrodes to provide an electrical connection between the plurality of bias electrodes and the mirror structures. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of fabricating an electrical connection for a spatial light modulator, the method comprising:
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providing a first substrate, the first substrate comprising;
a bias electrode array coupled to the first substrate, the bias electrode array having an upper surface and a lower surface; and
a dielectric standoff array coupled to the upper surface of the bias electrode array;
providing a second substrate having an upper surface and a bonding surface;
joining the dielectric standoff array to the bonding surface;
forming mirror structures from a portion of the second substrate;
exposing at least an upper surface of the conductive connector array; and
depositing a conductive layer on the mirror structures and the upper surface of the conductive connector array. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A spatial light modulator adapted to reflect incident light, the spatial light modulator comprising:
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a first substrate comprising a bias grid;
a bias electrode array coupled to the first substrate and electrically coupled to the bias grid;
a dielectric bond pad array coupled to the bias electrode array;
a standoff region array coupled to the dielectric bond pad array;
a plurality of mirror plates having an upper surface, the plurality of mirror plates flexibly coupled to the standoff region array; and
an electrically conductive layer deposited on the upper surface of the plurality of mirror plates and a portion of the bias electrode array to electrically couple the plurality of mirror plates to the bias electrode array. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification