Integrated packaged having magnetic components
First Claim
1. A packaged device, comprising:
- a substrate having first and second dielectric layers, the first dielectric layer having a first winding defined thereon, the second dielectric layer having a second winding defined thereon;
a magnetic assembly provided in the substrate;
an input die provided on the first dielectric layer to receive a first signal and transmit a second signal to the magnetic assembly;
an output die provided on the first dielectric layer to receive the second signal via the magnetic assembly and output a third signal to an external node; and
a package material provided over the magnetic assembly, the input die, and the output die to protect the magnetic assembly, the input die, and the output die from being damaged.
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Accused Products
Abstract
A packaged device is obtained using an innovative package approach that allows integration of miniature planar magnetics into standard low-cost semiconductor packages (BGA, PDIP, SOIC, etc.) with electronic and electrical components, where those components can be C&W and/or SMD types. The packaged device includes a planar magnetic substrate having first and second dielectric layers, the first dielectric layer having a first winding defined thereon, the second dielectric layer having a second winding defined thereon. A magnetic component is provided in the substrate. A package material provided at least partly around the substrate and the magnetic component to protect the substrate and magnetic component. The magnetic component is an inductor or transformer. The packaged device further includes at least one semiconductor component provided on the first dielectric layer.
67 Citations
22 Claims
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1. A packaged device, comprising:
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a substrate having first and second dielectric layers, the first dielectric layer having a first winding defined thereon, the second dielectric layer having a second winding defined thereon;
a magnetic assembly provided in the substrate;
an input die provided on the first dielectric layer to receive a first signal and transmit a second signal to the magnetic assembly;
an output die provided on the first dielectric layer to receive the second signal via the magnetic assembly and output a third signal to an external node; and
a package material provided over the magnetic assembly, the input die, and the output die to protect the magnetic assembly, the input die, and the output die from being damaged. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A packaged device, comprising:
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a planar magnetic substrate having first and second dielectric layers, the first dielectric layer having a first winding defined thereon, the second dielectric layer having a second winding defined thereon;
at least one magnetic component provided in the substrate; and
a package material provided at least partly around the substrate and the magnetic component to protect the substrate and magnetic component, wherein the magnetic component is integrated into the packaged device using a semiconductor package technology. - View Dependent Claims (18, 19, 20, 21, 22)
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Specification