Modular optical devices compatible with legacy form factors

• US 20060153507A1
• Filed: 05/20/2005
• Published: 07/13/2006
• Est. Priority Date: 05/21/2004
• Status: Abandoned Application

• Current Assignee: II-VI Delaware, Inc. (Coherent Corp.)
• Original Assignee: II-VI Delaware, Inc. (Coherent Corp.)
• Inventors: Togami, Chris K., Sasser, Gary
• Application Number:
  US11/134,530
• Publication Number:
  US 20060153507A1
• Time in Patent Office: Days
• US Class Current: 385/93
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures

Abstract

The present invention relates to modular optical devices compatible with legacy form factors, for example, SFF, SFP, and XFP form factors. A housing contains optical components including a lens block, a fabricated package, at least one lens pin, and a substrate. The lens block is configured to receive one or more lens pins. The fabricated package is mechanically coupled to the lens block and includes a light source and/or a light detector and a connector for coupling the fabricated package to the substrate. The at least one lens pin is mechanically coupled to the lens block for directing optical signals between the light source and/or light detector and external components. The substrate is mechanically coupled to the fabricated package and the housing and electrically connected to the light source and/or light detector such that substrate circuitry can electrically interoperate with the light source and/or light detector.

Claims

1. A modular optical device, comprising:

an external housing containing optical components, including;

a lens block configured such that one or more lens pins can mechanically couple to the lens block and such that the lens block can mechanically couple to a fabricated package;

a fabricated package mechanically coupled to the lens block, the fabricated package including at least one of a light source and a light detector, the fabricated package including a connector portion for connecting the fabricated package to a substrate; and

at least one lens pin mechanically coupled to the lens block, the at least one lens pin for directing an optical signal between the at least one of a light source and a light detector and at least one corresponding external component;

a substrate mechanically coupled to the fabricated package and the external housing and electrically connected to the at least one of a light source and a light detector such that circuitry on the substrate can electrically interoperate with the at least one of a light source and a light detector.

2. The modular optical device as recited in claim 1, wherein the external housing is of an SFF form factor.

3. The modular optical device as recited in claim 1, wherein the external housing is of an SFP form factor.

4. The modular optical device as recited in claim 1, wherein the external housing is of an XFP form factor.

5. The modular optical device as recited in claim 1, wherein the fabricated package includes a laser.

6. The modular optical device as recited in claim 1, wherein the fabricated package includes a photodiode.

7. The modular optical device as recited in claim 1, wherein the fabricated package is a plastic fabricated package.

8. The modular optical device as recited in claim 1, wherein the at least one lens pin mechanically coupled to the lens block is configured to direct an optical signal between the at least one of a light source and a light detector and a corresponding optical cable.

9. The modular optical device as recited in claim 1, further comprising an attachment portion that mechanically couples the lens block to the fabricated package, the attachment portion being selected from among epoxy, metal clips, and a laser weld.

10. An optoelectronic interface device comprising:

a host bus adapter having a printed circuit board with at least one connector for electrically interfacing with a host device; and

a modular optical device configured to mechanically and electrically interface with the host bus adapter, the modular optical device comprising;

a housing containing optical components, including;

a lens block configured such that that one or more lens pins can mechanically couple to the lens block and such that the lens block can mechanically couple to a fabricated package;

a fabricated package mechanically coupled to the lens block, the fabricated package including at least one of a light source and a light detector, the fabricated package including a connector portion for connecting the fabricated package to a substrate;

at least one lens pin mechanically coupled to the lens block, the at least one lens pin for directing an optical signal between the at least one of a light source and a light detector and at least one corresponding external component; and

a substrate mechanically coupled to the fabricated package and the external housing and electrically connected to the at least one of a light source and a light detector such that circuitry on the substrate can electrically interoperate with the at least one of a light source and a light detector.

11. The modular optical device as recited in claim 10, wherein the housing is of an SFF form factor.

12. The modular optical device as recited in claim 10, wherein the housing is of an SFP form factor.

13. The modular optical device as recited in claim 10, wherein the housing is of an XFP form factor.

14. The optoelectronic interface device as recited in claim 10, wherein the host bus adapter includes components for converting between an optical signal and an electrical signal.

15. The optoelectronic interface device as recited in claim 10, wherein the optoelectronic interface device is configured to be substantially received within a standard slot of the host device, the host device selected from among a desktop computer, a laptop computer, an optical hub, and an optical router.

16. The optoelectronic interface device as recited in claim 15, wherein the standard slot comprises one of:

a PCI card slot and a PCMCIA card slot.

17. The optoelectronic interface device as recited in claim 10, wherein the host bus adapter comprises a printed circuit board for one of:

a peripheral component interconnect card and a PCMCIA card.

18. A modular optical device comprising:

an external housing containing optical components, including;

a lens block configured such that a plurality of lens pins can mechanically couple to the lens block and such that the lens block can mechanically couple to a fabricated package;

a fabricated package mechanically coupled to the lens block, the fabricated package including a laser and a photodiode, the fabricated package including a connector for connecting the fabricated package to a substrate;

a substrate mechanically coupled to the fabricated package and the external housing and electrically connected to the laser and the photodiode via the connector such that circuitry on the substrate can electrically interoperate with the laser and the photodiode;

a first lens pin mechanically coupled to the lens block for directing an optical signal from the laser to an external component; and

a second lens pin mechanically coupled to the lens block for directing an optical signal from an external component to the photodiode.

19. The modular optical device as recited in claim 18, wherein the laser is a vertical cavity surface emitting laser.