Display manufacturing method

• US 20060153971A1
• Filed: 12/23/2005
• Published: 07/13/2006
• Est. Priority Date: 01/13/2005
• Status: Abandoned Application

• Current Assignee: Toshiba Matsushita Display Technology (Japan Display Incorporated)
• Original Assignee: Toshiba Matsushita Display Technology (Japan Display Incorporated)
• Inventors: Takehara, Toshifumi
• Application Number:
  US11/315,011
• Publication Number:
  US 20060153971A1
• Time in Patent Office: Days
• US Class Current: 427/66
• CPC Class Codes: H10K 59/35 comprising red-green-blue [RGB] subpixels
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/15 characterised by the solvent used
• CPC Class Codes: H10K 71/441 in the presence of solvent vapors, e.g. solvent vapour annealing

Abstract

A method of manufacturing a display includes supplying first regions on an underlayer with a first solution which contains a first organic solvent and a film-forming material dissolved or dispersed therein, wherein the first regions are spaced apart from each other, and wherein the film-forming material is to be used as a material of a layer included in a display element, selecting at least one out of the first regions which is insufficient in supply of the first solution, and supplying second regions on the underlayer surrounding the selected first region with a second solution which contains a second organic solvent and supplying the selected first region with a third solution which contains a third organic solvent and the film-forming material dissolved or dispersed therein.

Claims

1. A method of manufacturing a display, comprising:

supplying first regions on an underlayer with a first solution which contains a first organic solvent and a film-forming material dissolved or dispersed therein, wherein the first regions are spaced apart from each other, and wherein the film-forming material is to be used as a material of a layer included in a display element;

selecting at least one out of the first regions which is insufficient in supply of the first solution; and

supplying second regions on the underlayer surrounding the selected first region with a second solution which contains a second organic solvent and supplying the selected first region with a third solution which contains a third organic solvent and the film-forming material dissolved or dispersed therein.

2. The method according to claim 1, wherein the layer included in the display element is an organic layer included in an organic EL element, and wherein the film-forming material is an organic material.

3. The method according to claim 2, wherein the organic layer is an emission layer.

4. The method according to claim 2, wherein supplying the first regions with the first solution, supplying the second regions with the second solution, and supplying the selected first region with the third solution are carried out by ink-jet process.

5. The method according to claim 1, wherein supplying the first regions with the first solution, supplying the second regions with the second solution, and supplying the selected first region with the third solution are carried out by ink-jet process.

6. The method according to claim 1, wherein supplying the second regions with the second solution is carried out before supplying the selected first region with the third solution.

7. The method according to claim 1, wherein the second solution consists of the second organic solvent and unavoidable impurities.

8. The method according to claim 1, wherein the second solution further contains the film-forming material.

9. The method according to claim 1, the first and third solutions are equal in composition to each other.

10. A method of manufacturing a display, comprising:

supplying through-holes of a partition insulating layer formed on an insulating substrate with a first solution which contains a first organic solvent and a film-forming material dissolved or dispersed therein, wherein the film-forming material is to be used as a material of a layer included in a display element;

selecting one out of the through-holes which is insufficient in supply of the first solution; and

supplying regions on the partition insulating layer surrounding the selected through-hole with a second solution which contains a second organic solvent and supplying the selected through-hole with a third solution which contains a third organic solvent and the film-forming material dissolved or dispersed therein.

11. The method according to claim 10, wherein the layer included in the display element is an organic layer included in an organic EL element, and wherein the film-forming material is an organic material.

12. The method according to claim 11, wherein the organic layer is an emission layer.

13. The method according to claim 11, wherein supplying the through-holes with the first solution, supplying the regions with the second solution, and supplying the selected through-hole with the third solution are carried out by ink-jet process.

14. The method according to claim 10, wherein supplying the through-holes with the first solution, supplying the regions with the second solution, and supplying the selected through-hole with the third solution are carried out by ink-jet process.

15. The method according to claim 10, wherein supplying the regions with the second solution is carried out before supplying the selected through-hole with the third solution.

16. The method according to claim 10, wherein the second solution consists of the second organic solvent and unavoidable impurities.

17. The method according to claim 10, wherein the second solution further contains the film-forming material.

18. The method according to claim 10, the first and third solutions are equal in composition to each other.

19. A method of manufacturing a display, comprising:

supplying through-holes of a partition insulating layer formed on an insulating substrate with a first solution which contains a first organic solvent and a film-forming material dissolved or dispersed therein, wherein the partition insulating layer is provided with the through-holes and recesses, and wherein the film-forming material is to be used as a material of a layer included in a display element;

selecting one out of the through-holes which is insufficient in supply of the first solution; and

supplying parts of the recesses surrounding the selected through-hole with a second solution which contains a second organic solvent and supplying the selected through-hole with a third solution which contains a third organic solvent and the film-forming material dissolved or dispersed therein.

20. The method according to claim 19, wherein the layer included in the display element is an organic layer included in an organic EL element, and wherein the film-forming material is an organic material.

21. The method according to claim 20, wherein the organic layer is an emission layer.

22. The method according to claim 20, wherein supplying the through-holes with the first solution, supplying the recesses surrounding the selected through-hole with the second solution, and supplying the selected through-hole with the third solution are carried out by ink-jet process.

23. The method according to claim 19, wherein supplying the through-holes with the first solution, supplying the recesses surrounding the selected through-hole with the second solution, and supplying the selected through-hole with the third solution are carried out by ink-jet process.

24. The method according to claim 19, wherein supplying the recesses surrounding the selected through-hole with the second solution is carried out before supplying the selected through-hole with the third solution.

25. The method according to claim 19, wherein the second solution consists of the second organic solvent and unavoidable impurities.

26. The method according to claim 19, wherein the second solution further contains the film-forming material.

27. The method according to claim 19, the first and third solutions are equal in composition to each other.