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Systems and methods for removing operating heat from a light emitting diode

  • US 20060154393A1
  • Filed: 01/11/2005
  • Published: 07/13/2006
  • Est. Priority Date: 01/11/2005
  • Status: Abandoned Application
First Claim
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1. A method for cooling a light emitting diode, comprising:

  • forming a multilayer epitaxial structure above a carrier substrate;

    depositing at least one metal layer above the multilayer epitaxial structure;

    removing the carrier substrate; and

    forming one or more heat removal structures in the metal layer to dissipate heat.

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