Integrated sensor chip unit

• US 20060157701A1
• Filed: 01/10/2006
• Published: 07/20/2006
• Est. Priority Date: 07/19/2003
• Status: Abandoned Application

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Hagen, Jochen von, Bauer, Robert
• Application Number:
  US11/329,981
• Publication Number:
  US 20060157701A1
• Time in Patent Office: Days
• US Class Current: 257/48
• CPC Class Codes: A61B 5/145 Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissuemeasuring of blood pressure or blood flow A61B5/02; non-radiation detecting or locating of foreign bodies in blood A61B5/06
• CPC Class Codes: A61B 5/14532 for measuring glucose, e.g. by tissue impedance measurement
• CPC Class Codes: G01D 3/022 having an ideal characteristic, map or correction data stored in a digital memory
• CPC Class Codes: G01L 19/086 for remote indication
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

The invention relates to a sensor module, in particular a measured-value pickup (2) for determining measurement data and a circuit arrangement (3) for enabling a wire-free power supply and interrogation of the measurement data. The measured-value pickup is formed as an integrable sensor (2), and the circuit arrangement is formed as an integrated semiconductor circuit module (3), the sensor (2) and the semiconductor circuit module (3) being mechanically and electrically conductively connected to one another to form an integrated sensor chip unit (1) using microsystems engineering means.

Claims

1. An integrated sensor chip unit comprising:

a measured-value pickup operative to determine measurement data; and

a circuit arrangement operative to enable a wireless power supply and interrogation of the measurement data,

wherein the measured-value pickup is formed as an integratable sensor and the circuit arrangement is embodied as an integrated semiconductor circuit module, the sensor and the semiconductor circuit module mechanically and electrically conductively connected to one another using a microsystems engineering technology.

2. The integrated sensor chip unit of claim 1, wherein the semiconductor circuit module comprises a measured-value conditioning circuit.

3. The integrated sensor chip unit of claim 1, wherein the semiconductor circuit module comprises a measured-value conditioning circuit with a digitization stage.

4. The integrated sensor chip unit of claim 1, wherein the semiconductor circuit module comprises a remotely acting receiving unit operative to effect power supply and data exchange.

5. The integrated sensor chip unit of claim 1, wherein remote action of the remotely acting receiving unit comprises inductive coupling.

6. An integrated sensor chip unit comprising:

a measured-value pickup operative to determine measurement data;

a circuit arrangement operative to enable a wireless power supply and interrogation of the measurement data; and

an encapsulation surrounds the integrated sensor chip unit,

wherein the measured-value pickup is formed as an integratable sensor and the circuit arrangement is embodied as an integrated semiconductor circuit module, the sensor and the semiconductor circuit module mechanically and electrically conductively connected to one another using a microsystems engineering technology.

7. The integrated sensor chip unit of claim 6, wherein the encapsulation is comprised of materials that permit the integrated sensor chip unit to be implanted in human or animal bodies.

8. The integrated sensor chip unit of claim 6, wherein the encapsulation is comprised of materials that permit transport in bodily fluids.

9. The integrated sensor chip unit of claim 6, wherein the sensor chip unit is integratable in walls of a pipeline system.

10. The integrated sensor chip unit of claim 6, wherein the sensor comprises at least one of a biometric sensor, a glucose sensor, a blood oxygen sensor, a light absorption sensor, a pressure sensor, a thermo sensor, or a chemical sensor.

11. A method of fabricating an integrated sensor chip unit, the method comprising:

providing a measured-value pickup formed as an integratable sensor and operative to determine measurement data;

providing a circuit arrangement embodied as an integrated semiconductor circuit module and operative to enable a wireless power supply and interrogation of the measurement data; and

mechanically and electrically conductively connecting the sensor and the semiconductor circuit module to one another using a microsystems engineering technology.

12. The method of claim 11, wherein the microsystems engineering technology comprises flip-chip bonding.

13. The method of claim 11, wherein the semiconductor circuit module comprises a measured-value conditioning circuit.

14. The method of claim 11, wherein the semiconductor circuit module comprises a remotely acting receiving unit operative to effect power supply and data exchange.

15. The method of claim 11, wherein remote action of the remotely acting receiving unit comprises inductive coupling.

16. A method of fabricating an integrated sensor chip unit, the method comprising:

providing a measured-value pickup formed as an integratable sensor and operative to determine measurement data;

providing a circuit arrangement embodied as an integrated semiconductor circuit module and operative to enable a wireless power supply and interrogation of the measurement data;

mechanically and electrically conductively connecting the sensor and the semiconductor circuit module to one another using a microsystems engineering technology; and

encapsulating the integrated sensor chip unit in an encapsulation.

17. The method of claim 16, wherein the encapsulation is comprised of materials that permit the integrated sensor chip unit to be implanted in an animal body.

18. The method of claim 16, wherein the encapsulation is comprised of materials that permit transport in bodily fluids.

19. The method of claim 16, wherein the sensor chip unit is integratable in walls of a pipeline system.

20. An integrated sensor chip unit comprising:

means for determining measurement data; and

means for enabling a wireless power supply and interrogation of the measurement data that is mechanically and electrically conductively connected to the determining means using microsystems engineering means.

21. The integrated sensor chip unit of claim 20, wherein the enabling and interrogation means comprises means for digitizing the measurement data.

22. The integrated sensor chip unit of claim 20, wherein the enabling and interrogation means comprises means for effecting power supply and data exchange.

23. The integrated sensor chip unit of claim 20, wherein the means for effecting power supply and data exchange comprises means for inductive coupling.

24. The integrated sensor chip unit of claim 20, further comprising means for permitting the integrated sensor chip unit to be at least one of implanted in an animal body or transported in bodily fluids.

25. The integrated sensor chip unit of claim 20, further comprising means for permitting the sensor chip unit to be integrated in walls of a pipeline system.