APPARATUS AND METHOD FOR TRANSFERRING HEAT FROM CONTROL DEVICES

• US 20060158852A1
• Filed: 01/19/2005
• Published: 07/20/2006
• Est. Priority Date: 01/19/2005
• Status: Active Grant

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Wells, Owen Newton, Thomas, Sherman Glenn
• Granted Patent: US 7,130,196 B2
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff

Abstract

A control device configured for mounting within an enclosure having a thermally conductive surface is disclosed. The control device includes a housing, a heat-generating device disposed within the housing, and a thermal conductor. The thermal conductor has a first portion in thermal communication with the heat-generating device and a second portion configured to be in thermal communication with the thermally conductive surface of the enclosure.

Claims

1. A control device configured for mounting within an enclosure, the enclosure having at least one thermally conductive surface, the control device comprising:

a housing;

a heat-generating device disposed within the housing; and

a thermal conductor having a first portion in thermal communication with the heat-generating device and a second portion configured to be in thermal communication with the thermally conductive surface of the enclosure.

2. The control device of claim 1, wherein:

the housing comprises an opening; and

the second portion of the thermal conductor is disposed proximate the opening such that the opening provides for thermal communication between the thermal conductor and the thermally conductive surface of the enclosure.

3. The control device of claim 2, further comprising:

means for thermally attaching the second portion to the thermally conductive surface of the enclosure.

4. The control device of claim 1, wherein:

the heat-generating device comprises an electronic component.

5. The control device of claim 1, wherein:

the thermal conductor is a passive thermal conductor.

6. The control device of claim 1, wherein:

the heat-generating device comprises a set of electronic components configured to provide programmable logic control.

7. A control apparatus, comprising:

an enclosure having at least one thermally conductive surface; and

a control device disposed within the enclosure and in thermal communication with the thermally conductive surface of the enclosure, the control device comprising;

a housing;

a heat-generating device disposed within the housing; and

a thermal conductor having a first portion in thermal communication with the heat-generating device and a second portion in thermal communication with the thermally conductive surface of the enclosure.

8. The control apparatus of claim 7, wherein:

the housing comprises an opening; and

the second portion of the thermal conductor is disposed at the opening such that the opening provides for direct thermal communication between the heat-generating device and the thermally conductive surface of the enclosure via the thermal conductor.

9. The control apparatus of claim 7, further comprising:

a heat transfer medium disposed between the second portion and the thermally conductive surface of the enclosure.

10. The control apparatus of claim 7, wherein:

the heat-generating device comprises a set of electronic components configured to provide programmable logic control; and

the thermal conductor is a passive thermal conductor.

11. The control apparatus of claim 7, wherein:

the thermally conductive surface comprises a metal, a ceramic, a composite, or any combination comprising at least one of the foregoing materials.

12. The control apparatus of claim 7, wherein:

the control device is one of a plurality of modular control devices.

13. The control apparatus of claim 7, further comprising:

a fastener disposed at the second portion and configured to provide a compressive load between the second portion and the thermally conductive surface.

14. The control apparatus of claim 7, wherein:

the enclosure comprises a plurality of surfaces that define an interior volume that may be substantially absent fluid communication with the ambient external to the enclosure, the control device being disposed within the interior volume.

15. The control apparatus of claim 7, further comprising:

a heat exchanger in thermal communication with the second portion of the thermal conductor, the thermally conductive surface of the enclosure, or both.

16. A method of transferring heat from within a control apparatus to ambient, the control apparatus having an enclosure with a thermally conductive surface and a control device disposed therein, the control device having a housing with a heat-generating electronic component disposed therein and a thermal conductor with a first portion in thermal communication with the heat-generating electronic component and a second portion in direct thermal communication with the thermally conductive surface, the method comprising:

transferring heat from the heat generating electronic component to the first portion of the thermal conductor;

transferring heat from the first portion of the thermal conductor to the second portion of the thermal conductor along a thermal path that excludes the housing of the control device;

transferring heat from the second portion of the thermal conductor to the thermally conductive surface of the enclosure of the control apparatus; and

transferring heat from the thermally conductive surface to ambient.