TRANSCEIVER ASSEMBLY FOR USE IN FIBER OPTICS COMMUNICATIONS

• US 20060159403A1
• Filed: 03/02/2006
• Published: 07/20/2006
• Est. Priority Date: 09/17/2001
• Status: Active Grant

• Current Assignee: Stratos International Incorporated (Emerson Electric Company)
• Original Assignee: Stratos International Incorporated (Emerson Electric Company)
• Inventors: Kim, Brian, Cheng, Hengju, Chin, Jesse, Crews, Darren, Xu, Lee L.
• Granted Patent: US 7,073,955 B1
• Time in Patent Office: Days
• US Class Current: 385/86
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/4261 Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: G02B 6/428 containing printed circuit boards [PCB]
• CPC Class Codes: G02B 6/4281 the printed circuit boards being flexible in general H05K1/147
• CPC Class Codes: G02B 6/4283 with electrical insulation means
• CPC Class Codes: G02B 6/4284 of optical modules with disconnectable electrical connectors latching arms for electrical connectors H01R13/627
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Abstract

A transceiver assembly includes a frame section, a rigid circuit board, a flex circuit, and a controller chip. The frame section includes an optoelectronic device containing a set of photoactive components, a signal processing chip for providing drive signals to the set of photoactive components, and a flex circuit layer. The rigid circuit board includes a first rigid printed circuit board layer, a second rigid printed circuit board layer, and a flex circuit layer. The flex circuit also forms the flex circuit layers in the rigid circuit board and the frame section. The flex circuit is adapted for electrically coupling the first and second printed circuit board layers in the rigid circuit board to the frame section. The controller chip is mounted on a surface of the first rigid printed circuit board layer.

Claims

1. A transceiver assembly for use in fiber optics communications, the transceiver assembly comprising:

a) a frame section including an optoelectronic device containing a set of photoactive components, a signal processing chip for providing drive signals to said photoactive components, and a flex circuit layer;

b) a rigid circuit board including;

a first rigid printed circuit board layer,

a second rigid printed circuit board layer, and

a flex circuit layer positioned in between said first and second rigid printed circuit board layers;

c) a flex circuit which also forms the flex circuit layers in said rigid circuit board and in said frame section and which is adapted for electrically coupling said first and second printed circuit board layers in said rigid circuit board to said frame section; and

d) a controller chip mounted on a surface of said first rigid printed circuit board layer of said rigid circuit board for providing control signals to said signal processing chip.

2. The transceiver assembly of claim 1, wherein:

said photoactive components are vertical cavity surface-emitting semiconductor lasers.

3. The transceiver assembly of claim 1, further including:

e) an edge connector formed on one end of said rigid circuit board comprising a set of connection pads disposed on said first and second rigid printed circuit board layers.