Keypad module manufacturing method

• US 20060159506A1
• Filed: 07/20/2005
• Published: 07/20/2006
• Est. Priority Date: 01/14/2005
• Status: Abandoned Application

• Current Assignee: Quanta Computer
• Original Assignee: Quanta Computer
• Inventors: Cheng, Yung-Fa, Kao, Hsiang-Lung
• Application Number:
  US11/184,975
• Publication Number:
  US 20060159506A1
• Time in Patent Office: Days
• US Class Current: 400/472
• CPC Class Codes: H01H 13/88 Processes specially adapted for manufacture of rectilinearly movable switches having a plurality of operating members associated with different sets of contacts, e.g. keyboards
• CPC Class Codes: H01H 2229/02 Laser
• CPC Class Codes: H01H 2229/048 Insertion moulding

Abstract

A keypad module manufacturing method for reducing production time and enhancing yield is described. A lower substrate, with button holes and positioning holes, is manufactured. A rubber layer is formed upon the lower substrate. An upper substrate, with buttons and a cut-away portion, is manufactured. The upper substrate is attached to the rubber layer on the lower substrate. The cut-away portion is removed from the upper substrate by laser so as to form a keypad module.

Claims

1. A keypad module manufacturing method, comprising:

forming a first substrate, having a plurality of button holes and positioning holes;

forming a rubber layer upon said first substrate;

forming a second substrate, having a plurality of buttons and a cut-away portion thereof, said cut-away portion positioned between said buttons, and each of said buttons matching with a corresponding one of said button holes, attaching said second substrate to said rubber layer; and

removing said cut-away portion from said second substrate to form said plurality of buttons by means of a laser.

2. The keypad module manufacturing method of claim 1, wherein said positioning holes are properly positioned to secure said rubber layer.

3. The keypad module manufacturing method of claim 1, wherein said first substrate is made by mold pressing.

4. The keypad module manufacturing method of claim 2, wherein the step of forming said rubber layer comprising:

forming a buffer portion in said button holes of said first substrate;

forming a contact portion on said buffer portion to reach a switch on a printed circuit board;

forming a positioning portion in said positioning holes; and

forming a connection portion linking said buffer portion and said positioning portion.

5. The keypad module manufacturing method of claim 1, wherein said second substrate is made by trimming a raw material or mold-projection.

6. A keypad module manufacturing method, comprising:

forming a first substrate strip, having a series of first substrates linked together, and a clamp section positioned at two sides of said series of first substrates;

forming a series of rubber layers upon said series of first substrates;

forming a second substrate strip, having a series of second substrates linked together, and a clamp section positioned at two sides of said series of second substrates, each of said second substrates having a plurality of buttons and a cut-away portion thereof, and each of second substrates matching a corresponding one of said first substrates;

attaching said series of second substrates to said series of rubber layers; and

removing said cut-away portion from said series of second substrates to form said plurality of buttons by means of a laser.

7. The keypad module manufacturing method of claim 6, further comprises a step of forming a plurality of button holes and positioning holes in each of said series of first substrates, wherein said positioning holes are properly positioned to secure said rubber layer.

8. The keypad module manufacturing method of claim 6, wherein said first substrate strip is made by mold pressing.

9. The keypad module manufacturing method of claim 7, wherein the step of forming said series of rubber layers comprising:

forming a buffer portion of each of said series of rubber layers in said button holes of said series of first substrates;

forming a contact portion on each of said series of rubber layers to reach a switch on a printed circuit board;

forming a positioning portion of each of said series of rubber layers in said positioning holes of said series of first substrates; and

forming a connection portion linking said buffer portion and said positioning portion.

10. The keypad module manufacturing method of claim 7, wherein each of said buttons is formed in said series of second substrates and corresponding to one of said button holes in said series of first substrates respectively, and said cut-away portion is positioned between said buttons.

11. The keypad module manufacturing method of claim 6, wherein said second substrate strip is made by trimming a raw material or mold-projection.

12. The keypad module manufacturing method of claim 6, wherein the step of attaching said series of second substrates to said series of rubber layers further comprising:

mounting said clamp section of first substrate strip on a moving apparatus and moving said first substrate strip by said moving apparatus, wherein said series of rubber layers is formed upon said series of first substrates continuously while said first substrate strip is moved by said moving apparatus;

mounting said clamp section of second substrate strip on said moving apparatus, and

attaching said series of second substrates to said series of rubber layers while said first and second substrate strips are moved by said moving apparatus.

13. The keypad module manufacturing method of claim 6, further comprising a step of separating said series of first substrates.

14. A keypad module manufacturing method, comprising:

forming a first substrate plate, having a plurality of first substrates linked in columns and rows;

forming a plurality of rubber layers upon said plurality of first substrates;

forming a second substrate plate, having a plurality of second substrates linked in columns, each of said second substrates having a plurality of buttons and a cut-away portion thereof, and each of said second substrates matching a corresponding one of said first substrates;

attaching said plurality of second substrates to said plurality of rubber layers; and

removing said cut-away portion from said plurality of second substrates to form said plurality of buttons by means of a laser.

15. The keypad module manufacturing method of claim 14, further comprising a step of forming a plurality of button holes and positioning holes in each of said plurality of first substrates, wherein said positioning holes are properly positioned to secure said rubber layers.

16. The keypad module manufacturing method of claim 14, wherein said first substrate plate is made by mold pressing.

17. The keypad module manufacturing method of claim 15, wherein the step of forming said plurality of rubber layers comprising:

forming a buffer portion of each of said plurality of rubber layers in said button holes of said plurality of first substrates;

forming a contact portion on each of said plurality of rubber layers to reach a switch on a printed circuit board;

forming a positioning portion of each of said plurality of rubber layers in said positioning holes of said plurality of first substrates; and

forming a connection portion linking said buffer portion and said positioning portion.

18. The keypad module manufacturing method of claim 15, wherein each of said buttons is formed in said plurality of second substrates and corresponding to one of said button holes in said plurality of first substrates respectively, and said cut-away portion is positioned between said buttons.

19. The keypad module manufacturing method of claim 14, wherein said second substrate plate is made by trimming a raw material or mold-projection.

20. The keypad module manufacturing method of claim 14, further comprises a step of separating said plurality of first substrates.