Method of substrate treatment for manufacturing of color filters by inkjet printing systems

• US 20060159843A1
• Filed: 01/18/2005
• Published: 07/20/2006
• Est. Priority Date: 01/18/2005
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Shang, Quanyuan, White, John M., Sze, Fan-Cheung
• Application Number:
  US11/039,603
• Publication Number:
  US 20060159843A1
• Time in Patent Office: Days
• US Class Current: 427/68
• CPC Class Codes: G02F 1/133512 Light shielding layers, e.g. black matrix G02F1/136209 takes precedence
• CPC Class Codes: G02F 1/133516 Methods for their manufacture, e.g. printing, electro-deposition or photolithography

Abstract

A method for treating a glass substrate and a black matrix thereon for a flat panel display is provided. In one application, the treatment of the glass substrate and black matrix is performed prior to delivery of ink to the glass substrate by an inkjet printing system. The black matrix and glass substrate are exposed to a surface active compound. In one aspect, exposing the black matrix and the glass substrate to a surface active compound modifies the surface energy of the black matrix, the surface energy of the glass substrate, or both. In another aspect, treating the black matrix and the glass substrate enhances the formation of color filters having sub-pixel wells that have a substantially uniform distribution of ink therein.

Claims

1. A method of treating a glass substrate and a black matrix thereon for a flat panel display, comprising:

exposing the glass substrate and the black matrix to a surface active compound under conditions sufficient to increase or decrease the ink-phobicity or ink-philicity of at least one member selected from the group consisting of the black matrix and an outer surface of the glass substrate that is not covered by the black matrix prior to delivery of an ink within sub-pixel wells of the black matrix.

2. The method of claim 1 wherein the black matrix comprises an outer surface, and the exposing the black matrix to the surface active compound increases or decreases the ink-phobicity of the outer surface of the black matrix.

3. The method of claim 1 wherein the exposing the glass substrate to the surface active compound increases or decreases the ink-phobicity of the outer surface of the glass substrate.

4. The method of claim 1 wherein the black matrix comprises an outer surface, and the exposing the black matrix to the surface active compound increases or decreases the ink-philicity of the outer surface of the black matrix.

5. The method of claim 1 wherein the exposing the glass substrate to the surface active compound increases or decreases the ink-philicity of the outer surface of the glass substrate.

6. The method of claim 1 wherein the surface active compound is selected from the group consisting of silane-based organic compounds, fluorinated hydrocarbons, long chain hydrocarbon-based acids, long chain hydrocarbon-based esters, long chain hydrocarbon-based phosphates, long chain hydrocarbon-based sulfates, and combinations thereof.

7. The method of claim 1 wherein the surface active compound is dissolved in one or more volatile solvents before the glass substrate and the black matrix are exposed to the surface active compound.

8. The method of claim 1 wherein the surface active compound is vaporized before the glass substrate and the black matrix are exposed to the surface active compound.

9. The method of claim 1 wherein a layer having a thickness of about a submonolayer to about 100 Å

is deposited from the surface active compound on the black matrix and the glass substrate.

10. (canceled)

11. A method of treating a glass substrate and a black matrix thereon for a flat panel display, comprising:

exposing the glass substrate and the black matrix to a surface active compound under conditions sufficient to modify the surface energy of at least one member selected from the group consisting of the black matrix and an outer surface of the glass substrate that is not covered by the black matrix prior to delivery of an ink within sub-pixel wells of the black matrix, wherein the difference between the modified surface energy of the black matrix or glass substrate and the surface energy of the ink is between about 4 dynes/cm and about 12 dynes/cm.

12. The method of claim 11 wherein the black matrix comprises an outer surface, and modifying the surface energy comprises increasing or decreasing the ink-phobicity of the outer surface of the black matrix.

13. The method of claim 11 wherein modifying the surface energy comprises increasing or decreasing the ink-phobicity of the outer surface of the glass substrate.

14. The method of claim 11 wherein the black matrix comprises an outer surface, and modifying the surface energy of the black matrix comprises increasing or decreasing the ink-philicity of the outer surface of the black matrix.

15. The method of claim 11 wherein modifying the surface energy comprises increasing or decreasing the ink-philicity of the outer surface of the glass substrate.

16. The method of claim 11 wherein the difference between the modified surface energy of the black matrix or glass substrate and the surface energy of the ink is about 10+/−

2 dynes/cm.

26. The method of claim 11 wherein the surface energy is modified such that the radius of a drop of the ink deposited on the exposed glass substrate is between about 6% and about 30% less than the radius of a drop of the ink deposited on the glass substrate prior to the exposure to a surface active compound, and the radius of a drop of the ink deposited on the exposed black matrix is between about 6% and about 30% less than the radius of a drop of the ink deposited on the black matrix prior to the exposure to a surface active compound.

17. A method of treating a glass substrate and a black matrix thereon for a flat panel display, comprising:

exposing the glass substrate and the black matrix to a surface active compound under conditions sufficient to modify the surface energy of at least one member selected from the group consisting of the black matrix and an outer surface of the glass substrate that is not covered by the black matrix prior to delivery of an ink within sub-pixel wells of the black matrix, wherein the surface energy is modified such that the ratio of a drop radius of the ink on the black matrix to a drop radius of the ink on the glass substrate is changed from greater than about 1;

1 or less than about 0.8;

1 to between about 0.8;

1 and about 1;

1 after the exposure to a surface active compound.

18. The method of claim 17 wherein modifying the surface energy comprises decreasing the ink-philicity of both the black matrix and the glass substrate.

19. The method of claim 17 wherein modifying the surface energy comprises increasing the ink-phobicity of the black matrix relative to the glass substrate.

20. The method of claim 17 wherein the surface active compound has a higher surface energy than the surface energy of the black matrix prior to the exposure of the black matrix to the surface active compound, and the surface active compound has a lower surface energy than the surface energy of the glass substrate prior to the exposure of the glass substrate to the surface active compound.

21. The method of claim 20 wherein modifying the surface energy comprises increasing the ink-philicity of the black matrix and increasing the ink-phobicity of the glass substrate.

22. An apparatus for treating a glass substrate and a black matrix thereon for a flat panel display, comprising:

a vaporizer;

a source of a surface active compound connected to the vaporizer;

a heated applicator adapted to distribute a vaporized precursor comprising the surface active compound to a glass substrate and a black matrix thereon; and

a heated line connecting the vaporizer and the heated applicator.

23. The apparatus of claim 22 wherein the heated applicator comprises multiple nozzles.

24. The apparatus of claim 22 further comprising a homogenizer disposed in the vaporizer.

25. The apparatus of claim 22 further comprising a source of carrier gas connected to the heated line.